Taiwan semiconductor manufacturing co., ltd. (20240222312). METHOD FOR FORMING A PACKAGE STRUCTURE simplified abstract
Contents
METHOD FOR FORMING A PACKAGE STRUCTURE
Organization Name
taiwan semiconductor manufacturing co., ltd.
Inventor(s)
Kai Jun Zhan of Taoyuan City (TW)
Chang-Jung Hsueh of Taipei City (TW)
Hui-Min Huang of Taoyuan City (TW)
Wei-Hung Lin of Xinfeng Township (TW)
Ming-Da Cheng of Taoyuan City (TW)
METHOD FOR FORMING A PACKAGE STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240222312 titled 'METHOD FOR FORMING A PACKAGE STRUCTURE
The abstract of the patent application describes a method for forming a package structure. This method involves transporting a first package component into a processing chamber, positioning it on a chuck table, heating it using the chuck table, and bonding it with a second package component using a bonding head that communicates with vacuum devices.
- The method involves transporting a first package component into a processing chamber.
- The first package component is positioned on a chuck table for heating.
- A second package component is held with a bonding head that communicates with vacuum devices.
- The bonding head bonds the first and second package components in the processing chamber.
- The vacuum devices operate independently, allowing for precise control over the bonding process.
Potential Applications: - Semiconductor packaging - Electronics manufacturing - Microelectromechanical systems (MEMS) fabrication
Problems Solved: - Precise and controlled bonding of package components - Efficient package structure formation - Enhanced reliability of package structures
Benefits: - Improved package structure quality - Increased production efficiency - Enhanced reliability of electronic devices
Commercial Applications: Title: Advanced Package Structure Formation Technology This technology can be used in the semiconductor industry for manufacturing advanced electronic devices with high reliability and performance. It can also be applied in the production of MEMS devices and other microelectronics.
Questions about the technology: 1. How does the method of bonding package components using vacuum devices improve the reliability of package structures? 2. What are the potential cost savings associated with using this advanced package structure formation technology?
Original Abstract Submitted
a method for forming a package structure is provided. the method includes transporting a first package component into a processing chamber. the method includes positioning the first package component on a chuck table. the method includes using the chuck table to heat the first package component. the method includes holding a second package component with a bonding head. the bonding head communicates with a plurality of vacuum devices via a plurality of vacuum tubes, and the vacuum devices each operate independently. the method also includes bonding the first package component and the second package component in the processing chamber to form the package structure.
