Taiwan semiconductor manufacturing co., ltd. (20240222307). INTEGRATED CIRCUIT PACKAGES simplified abstract
Contents
INTEGRATED CIRCUIT PACKAGES
Organization Name
taiwan semiconductor manufacturing co., ltd.
Inventor(s)
Chien-Hsun Chen of Zhutian Township (TW)
Jiun Yi Wu of Zhongli City (TW)
INTEGRATED CIRCUIT PACKAGES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240222307 titled 'INTEGRATED CIRCUIT PACKAGES
The abstract describes a device comprising a semiconductor device and a redistribution structure with various features such as dielectric layers, grounding features, and transmission lines.
- The device includes a semiconductor device and a redistribution structure.
- The redistribution structure consists of a first dielectric layer, first and second grounding features, and a first pair of transmission lines.
- The first pair of transmission lines is electrically coupled to the semiconductor device and is laterally disposed between the first and second grounding features.
- A second dielectric layer covers the first grounding feature, second grounding feature, and the first pair of transmission lines.
- A third grounding feature extends laterally along and through the second dielectric layer, physically and electrically coupled to the first and second grounding features, with the first pair of transmission lines extending continuously along its length.
Potential Applications:
- This technology can be applied in the field of semiconductor devices for improved signal transmission and grounding capabilities.
- It can be used in high-frequency applications where signal integrity and electromagnetic interference are critical.
Problems Solved:
- Enhances signal transmission efficiency and reduces electromagnetic interference.
- Provides better grounding solutions for semiconductor devices.
Benefits:
- Improved signal integrity and reduced interference.
- Enhanced performance of semiconductor devices.
Commercial Applications:
- This technology can be utilized in the telecommunications industry for high-speed data transmission.
- It can also be beneficial in the aerospace industry for reliable communication systems.
Prior Art:
- Researchers can explore prior patents related to semiconductor device structures, transmission lines, and grounding features to understand the evolution of similar technologies.
Frequently Updated Research:
- Researchers can stay updated on advancements in semiconductor device structures, transmission line technologies, and grounding solutions to enhance the performance of electronic devices.
Questions about the Technology: 1. How does this technology improve signal transmission efficiency in semiconductor devices? 2. What are the potential commercial applications of this technology in different industries?
Original Abstract Submitted
in an embodiment, a device includes: a semiconductor device; and a redistribution structure including: a first dielectric layer; a first grounding feature on the first dielectric layer; a second grounding feature on the first dielectric layer; a first pair of transmission lines on the first dielectric layer, the first pair of transmission lines being laterally disposed between the first grounding feature and the second grounding feature, the first pair of transmission lines being electrically coupled to the semiconductor device; a second dielectric layer on the first grounding feature, the second grounding feature, and the first pair of transmission lines; and a third grounding feature extending laterally along and through the second dielectric layer, the third grounding feature being physically and electrically coupled to the first grounding feature and the second grounding feature, where the first pair of transmission lines extend continuously along a length of the third grounding feature.
