Taiwan semiconductor manufacturing co., ltd. (20240222292). Method for Sigulating Semiconductor Devices and Package Device Including the Semiconductor Devices simplified abstract
Contents
Method for Sigulating Semiconductor Devices and Package Device Including the Semiconductor Devices
Organization Name
taiwan semiconductor manufacturing co., ltd.
Inventor(s)
Yung-Chi Lin of Su-Lin City (TW)
Method for Sigulating Semiconductor Devices and Package Device Including the Semiconductor Devices - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240222292 titled 'Method for Sigulating Semiconductor Devices and Package Device Including the Semiconductor Devices
The abstract describes a device with an integrated circuit die and a semiconductor feature, each having chamfered corners.
- Integrated circuit die with three sidewalls connected to form a chamfered corner.
- First dielectric surrounding the integrated circuit die.
- Semiconductor feature with three sidewalls connected to form a chamfered corner.
- Second dielectric surrounding the semiconductor feature.
Potential Applications: - Semiconductor manufacturing - Electronics industry - Integrated circuit design
Problems Solved: - Enhancing the structural integrity of integrated circuit dies and semiconductor features. - Improving the overall performance and reliability of electronic devices.
Benefits: - Increased durability and longevity of electronic components. - Enhanced functionality and efficiency of integrated circuits. - Potential for miniaturization and improved performance in electronic devices.
Commercial Applications: Title: "Innovative Semiconductor Feature Design for Enhanced Performance" This technology could be applied in various electronic devices such as smartphones, computers, and IoT devices, leading to more reliable and efficient products in the market.
Prior Art: Researchers can explore existing patents related to semiconductor manufacturing processes, integrated circuit design, and semiconductor feature structures to understand the novelty of this technology.
Frequently Updated Research: Researchers in the field of semiconductor engineering and integrated circuit design may provide updates on advancements in chamfered corner structures for electronic components.
Questions about the Technology: 1. How does the chamfered corner design impact the overall performance of the integrated circuit die and semiconductor feature? 2. Are there any specific manufacturing processes required to implement the chamfered corner design in electronic components?
Original Abstract Submitted
in an embodiment, a device includes an integrated circuit die including a first sidewall, a second sidewall, and a third sidewall, wherein the third sidewall of the integrated circuit die is connected to the first sidewall of the integrated circuit die and the second sidewall of the integrated circuit die, wherein the third sidewall of the integrated circuit die forms a chamfered corner of the integrated circuit die; a first dielectric surrounding the integrated circuit die; a semiconductor feature disposed over the integrated circuit die, wherein the semiconductor feature includes a first sidewall, a second sidewall, and a third sidewall, wherein the third sidewall of the semiconductor feature is connected to the first sidewall of the semiconductor feature and the second sidewall of the semiconductor feature and forms a chamfered corner of the semiconductor feature; and a second dielectric surrounding the semiconductor feature.
