Taiwan semiconductor manufacturing co., ltd. (20240222291). SEMICONDUCTOR PACKAGE WITH REDISTRIBUTION STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract

SEMICONDUCTOR PACKAGE WITH REDISTRIBUTION STRUCTURE AND MANUFACTURING METHOD THEREOF

Organization Name

taiwan semiconductor manufacturing co., ltd.

Inventor(s)

Wei-Cheng Wu of Hsinchu City (TW)

Chien-Chia Chiu of Taoyuan City (TW)

Cheng-Hsien Hsieh of Kaohsiung City (TW)

Li-Han Hsu of Hsin-Chu City (TW)

Meng-Tsan Lee of Hsinchu (TW)

Tsung-Shu Lin of New Taipei City (TW)

SEMICONDUCTOR PACKAGE WITH REDISTRIBUTION STRUCTURE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240222291 titled 'SEMICONDUCTOR PACKAGE WITH REDISTRIBUTION STRUCTURE AND MANUFACTURING METHOD THEREOF

Simplified Explanation: The semiconductor package described in the patent application consists of a semiconductor die, a redistribution structure, and connective terminals. The redistribution structure is located on the semiconductor die and includes a first metallization tier sandwiched between two dielectric layers. The first metallization tier contains conductive traces for routing and a shielding plate that is electrically insulated from the semiconductor die. The connective terminals consist of dummy connective terminals and active connective terminals. The dummy connective terminals are connected to the shielding plate, while the active connective terminals are connected to the routing conductive traces.

Key Features and Innovation:

• Semiconductor package with a redistribution structure and connective terminals
• First metallization tier with routing conductive traces and a shielding plate
• Dummy connective terminals connected to the shielding plate
• Active connective terminals connected to the routing conductive traces

Potential Applications: This technology can be applied in various semiconductor packaging applications where efficient routing and electrical connections are required.

Problems Solved: This technology addresses the need for improved connectivity and shielding in semiconductor packages.

Benefits:

• Enhanced routing and electrical connections
• Improved shielding for the semiconductor die

Commercial Applications: Potential commercial applications include semiconductor packaging for consumer electronics, telecommunications, and automotive industries.

Prior Art: Readers can start searching for prior art related to this technology in the field of semiconductor packaging and interconnect technologies.

Frequently Updated Research: Stay updated on the latest advancements in semiconductor packaging and interconnect technologies to further enhance the efficiency and performance of this technology.

Questions about Semiconductor Packaging: 1. What are the key components of a semiconductor package? 2. How does the redistribution structure improve the performance of the semiconductor package?

Original Abstract Submitted

a semiconductor package includes a semiconductor die, a redistribution structure and connective terminals. the redistribution structure is disposed on the semiconductor die and includes a first metallization tier disposed in between a pair of dielectric layers. the first metallization tier includes routing conductive traces electrically connected to the semiconductor die and a shielding plate electrically insulated from the semiconductor die. the connective terminals include dummy connective terminals and active connective terminals. the dummy connective terminals are disposed on the redistribution structure and are electrically connected to the shielding plate. the active connective terminals are disposed on the redistribution structure and are electrically connected to the routing conductive traces. vertical projections of the dummy connective terminals fall on the shielding plate.