Taiwan semiconductor manufacturing co., ltd. (20240222281). INTEGRATED CIRCUIT simplified abstract
Contents
INTEGRATED CIRCUIT
Organization Name
taiwan semiconductor manufacturing co., ltd.
Inventor(s)
Shih-Wei Peng of Hsinchu City (TW)
Chia-Tien Wu of Taichung City (TW)
Jiann-Tyng Tzeng of Hsinchu City (TW)
INTEGRATED CIRCUIT - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240222281 titled 'INTEGRATED CIRCUIT
Simplified Explanation: The patent application describes an integrated circuit with conductive rails in different layers, signal rails, vias coupling signal rails to conductive rails, and conductive segments transmitting supply signals.
- Conductive rails in a first layer are separated in layout view.
- Signal rails in a second layer are different from the first layer.
- Vias connect signal rails to conductive rails.
- Conductive segments above the first layer transmit supply signals.
- Segments are separate from signal rails.
Key Features and Innovation:
- Integration of conductive and signal rails in different layers.
- Use of vias to couple signal rails to conductive rails.
- Transmission of supply signals through conductive segments.
Potential Applications:
- Semiconductor industry for integrated circuits.
- Electronics manufacturing for improved circuit design.
Problems Solved:
- Efficient signal transmission in integrated circuits.
- Enhanced layout design for better performance.
Benefits:
- Improved signal integrity.
- Enhanced circuit efficiency.
- Better overall performance.
Commercial Applications: The technology can be applied in the semiconductor industry for the development of advanced integrated circuits, leading to more efficient and reliable electronic devices.
Prior Art: Readers can explore prior patents related to integrated circuit design, signal transmission, and layout optimization in the semiconductor industry.
Frequently Updated Research: Stay updated on the latest advancements in integrated circuit design, signal transmission technologies, and layout optimization for improved performance.
Questions about Integrated Circuits: 1. How does the integration of conductive and signal rails in different layers improve circuit performance? 2. What are the potential challenges in implementing this technology in commercial electronic devices?
Original Abstract Submitted
an integrated circuit includes conductive rails that are disposed in a first conductive layer and separated from each other in a layout view, signal rails disposed in a second conductive layer different from the first conductive layer, at least one first via coupling a first signal rail of the signal rails to at least one of the conductive rails, and at least one first conductive segment. the first signal rail transmits a supply signal through the at least one first via and the at least one of the conductive rails to at least one element of the integrated circuit. the at least one first via and the at least one first conductive segment are disposed above first conductive layer. the at least one first conductive segment is coupled to the at least one of the conductive rails and is separate from the first signal rail.
