Taiwan semiconductor manufacturing co., ltd. (20240222215). PACKAGE STRUCTURE COMPRISING BUFFER LAYER FOR REDUCING THERMAL STRESS AND METHOD OF FORMING THE SAME simplified abstract

PACKAGE STRUCTURE COMPRISING BUFFER LAYER FOR REDUCING THERMAL STRESS AND METHOD OF FORMING THE SAME

Organization Name

taiwan semiconductor manufacturing co., ltd.

Inventor(s)

Wei-Chih Chen of Taipei City (TW)

Chien-Hsun Lee of Hsin-chu County (TW)

Chung-Shi Liu of Hsinchu City (TW)

Hao-Cheng Hou of Hsinchu City (TW)

Hung-Jui Kuo of Hsinchu City (TW)

Jung-Wei Cheng of Hsinchu City (TW)

Tsung-Ding Wang of Tainan (TW)

Yu-Hsiang Hu of Hsinchu City (TW)

Sih-Hao Liao of New Taipei City (TW)

PACKAGE STRUCTURE COMPRISING BUFFER LAYER FOR REDUCING THERMAL STRESS AND METHOD OF FORMING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240222215 titled 'PACKAGE STRUCTURE COMPRISING BUFFER LAYER FOR REDUCING THERMAL STRESS AND METHOD OF FORMING THE SAME

The package structure described in the patent application includes a first die, a second die, a first encapsulant, and a buffer layer. The first die and the second die are placed side by side, with the first encapsulant encapsulating both dies. The second die contains a die stack encapsulated by a second encapsulant, with a buffer layer positioned between the two encapsulants.

• The package structure consists of a first die, a second die, a first encapsulant, and a buffer layer.
• The first die and the second die are arranged side by side within the package structure.
• A first encapsulant encapsulates both the first die and the second die.
• The second die includes a die stack encapsulated by a second encapsulant.
• A buffer layer is placed between the first encapsulant and the second encapsulant, covering at least a sidewall of the second die.
• The buffer layer has a Young's modulus lower than that of the first encapsulant and the second encapsulant.

Potential Applications: - This package structure could be used in semiconductor devices to enhance reliability and performance. - It may find applications in the automotive industry for electronic control units. - The technology could be utilized in consumer electronics for compact and durable electronic components.

Problems Solved: - Provides improved protection and insulation for delicate electronic components. - Enhances the overall reliability and longevity of semiconductor devices. - Helps in reducing the risk of damage due to external factors.

Benefits: - Increased durability and reliability of electronic components. - Enhanced performance of semiconductor devices. - Potential cost savings due to reduced risk of damage and failure.

Commercial Applications: Title: Advanced Package Structure for Semiconductor Devices This technology could be commercially applied in the semiconductor industry for the production of high-performance and reliable electronic components. It could also have applications in various other industries such as automotive, consumer electronics, and telecommunications.

Questions about the technology: 1. How does the buffer layer contribute to the overall reliability of the package structure? The buffer layer acts as a protective barrier between the encapsulants, reducing the risk of damage to the electronic components and enhancing the overall reliability of the package structure.

2. What are the potential cost-saving benefits of using this advanced package structure in semiconductor devices? By improving the durability and reliability of electronic components, this technology can help reduce the risk of damage and failure, leading to potential cost savings in the long run.

Original Abstract Submitted

a package structure and a method of forming the same are provided. the package structure includes a first die, a second die, a first encapsulant, and a buffer layer. the first die and the second die are disposed side by side. the first encapsulant encapsulates the first die and the second die. the second die includes a die stack encapsulated by a second encapsulant encapsulating a die stack. the buffer layer is disposed between the first encapsulant and the second encapsulant and covers at least a sidewall of the second die and disposed between the first encapsulant and the second encapsulant. the buffer layer has a young's modulus less than a young's modulus of the first encapsulant and a young's modulus of the second encapsulant.