Taiwan semiconductor manufacturing co., ltd. (20240222121). METHOD AND APPARATUS FOR COATING PHOTO RESIST OVER A SUBSTRATE simplified abstract
Contents
METHOD AND APPARATUS FOR COATING PHOTO RESIST OVER A SUBSTRATE
Organization Name
taiwan semiconductor manufacturing co., ltd.
Inventor(s)
Tung-Hung Feng of Hsinchu (TW)
Sheng-Wen Jiang of Hsinchu (TW)
Shih-Che Wang of Hsinchu City (TW)
METHOD AND APPARATUS FOR COATING PHOTO RESIST OVER A SUBSTRATE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240222121 titled 'METHOD AND APPARATUS FOR COATING PHOTO RESIST OVER A SUBSTRATE
The method described in the patent application involves coating a photo resist over a wafer by dispensing the photo resist from a nozzle while rotating the wafer.
- The dispensing of the photo resist is started and stopped while the wafer is rotating.
- The wafer rotation speed is changed at least 4 times between starting and stopping the dispensing of the photo resist.
- During dispensing, the arm holding the nozzle may move horizontally.
- The tip end of the nozzle is located at a height of 2.5 mm to 3.5 mm from the wafer.
Potential Applications: - Semiconductor manufacturing - Microelectronics industry - Nanotechnology research
Problems Solved: - Uniform coating of photo resist on wafers - Precision control of dispensing process - Enhanced efficiency in wafer processing
Benefits: - Improved quality of semiconductor devices - Increased productivity in manufacturing processes - Cost-effective solution for coating wafers
Commercial Applications: - Wafer fabrication facilities - Research institutions - Semiconductor equipment manufacturers
Questions about the technology: 1. How does the method of changing the wafer rotation speed improve the coating process? 2. What are the advantages of having the nozzle arm move horizontally during dispensing?
Original Abstract Submitted
in a method of coating a photo resist over a wafer, dispensing the photo resist from a nozzle over the wafer is started while rotating the wafer, and dispensing the photo resist is stopped while rotating the wafer. after starting and before stopping the dispensing the photo resist, a wafer rotation speed is changed at least 4 times. during dispensing, an arm holding the nozzle may move horizontally. a tip end of the nozzle may be located at a height of 2.5 mm to 3.5 mm from the wafer.
