Taiwan semiconductor manufacturing co., ltd. (20240222120). FACTORY SYSTEM AND METHOD FOR FORMING SEMICONDUCTOR STRUCTURE simplified abstract

FACTORY SYSTEM AND METHOD FOR FORMING SEMICONDUCTOR STRUCTURE

Organization Name

taiwan semiconductor manufacturing co., ltd.

Inventor(s)

Xianhui Zhou of Shanghai City (CN)

Lei Wang of Shanghai City (CN)

Jie Chen of Shanghai City (CN)

Zihao Zhang of Shanghai City (CN)

Renqin Liao of Shanghai City (CN)

Jilong Gu of Shanghai City (CN)

FACTORY SYSTEM AND METHOD FOR FORMING SEMICONDUCTOR STRUCTURE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240222120 titled 'FACTORY SYSTEM AND METHOD FOR FORMING SEMICONDUCTOR STRUCTURE

The method described in the abstract involves coating a wafer with a photoresist layer, transferring it between different tools, and performing an exposing process to pattern the photoresist layer.

• Coating process performed on a wafer to create a photoresist layer using a coating tool.
• Wafer retrieved to a cassette on the coating tool after the coating process.
• Cassette transferred from the coating tool to a load port of an exposure tool external to the coating tool.
• Wafer transferred from the cassette on the load port of the exposure tool to a wafer stage of the exposure tool.
• Exposing process performed on the wafer to pattern the photoresist layer.

Potential Applications: - Semiconductor manufacturing - Photolithography processes - Integrated circuit fabrication

Problems Solved: - Efficient transfer of wafers between different tools - Precise patterning of photoresist layers - Streamlining semiconductor manufacturing processes

Benefits: - Improved accuracy in patterning - Enhanced efficiency in wafer handling - Increased productivity in semiconductor fabrication

Commercial Applications: Title: Advanced Wafer Coating and Patterning Technology for Semiconductor Manufacturing This technology can be utilized in semiconductor fabrication facilities to enhance the efficiency and accuracy of photoresist layer patterning processes, ultimately leading to improved quality and productivity in the production of integrated circuits.

Questions about Wafer Coating and Patterning Technology: 1. How does this technology impact the overall efficiency of semiconductor manufacturing processes? 2. What are the key advantages of using this method for photoresist layer patterning in comparison to traditional techniques?

Original Abstract Submitted

a method includes performing a coating process on a first one of wafers to form a photoresist layer using a coating tool; after performing the coating process, retrieving the first one of the wafers to a cassette docked on the coating tool; transferring the cassette from the coating tool to a load port of an exposure tool external to the coating tool; transferring the first one of the wafers from the cassette on the load port of the exposure tool to a wafer stage of the exposure tool; performing an exposing process on the first one of the wafers to pattern the photoresist layer on the first one of the wafers.