Taiwan semiconductor manufacturing co., ltd. (20240222097). METHODS FOR PROCESSING A SEMICONDUCTOR SUBSTRATE simplified abstract
Contents
METHODS FOR PROCESSING A SEMICONDUCTOR SUBSTRATE
Organization Name
taiwan semiconductor manufacturing co., ltd.
Inventor(s)
Yu-Hsiang Cheng of Hsinchu (TW)
METHODS FOR PROCESSING A SEMICONDUCTOR SUBSTRATE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240222097 titled 'METHODS FOR PROCESSING A SEMICONDUCTOR SUBSTRATE
The present disclosure pertains to methods of processing a semiconductor substrate in a processing chamber, such as a chemical vapor deposition chamber. The chamber includes a spindle mechanism that moves the substrate from one station to another. The methods involve monitoring spindle operation parameters and performing maintenance steps based on the results to address undesirable vibration of the substrates, which can lead to the generation of unwanted particles on the substrate surface.
- Spindle mechanism in a processing chamber moves semiconductor substrates between stations.
- Monitoring spindle operation parameters to detect undesirable vibration of substrates.
- Performing maintenance steps based on monitoring results to prevent particle generation on substrate surfaces.
Potential Applications: - Semiconductor manufacturing processes - Chemical vapor deposition chambers - High-precision substrate processing industries
Problems Solved: - Minimizing vibration-induced particle contamination on semiconductor substrates - Enhancing the quality and yield of semiconductor manufacturing processes
Benefits: - Improved substrate processing efficiency - Reduced particle contamination risks - Enhanced semiconductor device performance
Commercial Applications: Title: Advanced Semiconductor Substrate Processing Technology This technology can be utilized in semiconductor fabrication facilities to optimize substrate processing, improve product quality, and reduce manufacturing defects. It has significant implications for the semiconductor industry, particularly in enhancing production efficiency and yield.
Questions about Semiconductor Substrate Processing: 1. How does the spindle mechanism contribute to reducing vibration in semiconductor substrate processing?
- The spindle mechanism in the processing chamber helps to minimize vibration by precisely moving the substrates between stations, reducing the risk of particle contamination.
2. What are the key advantages of monitoring spindle operation parameters in semiconductor processing?
- Monitoring spindle operation parameters allows for proactive maintenance to address vibration issues, leading to improved substrate quality and yield.
Original Abstract Submitted
the present disclosure relates to methods of processing a semiconductor substrate in a processing chamber, such as a chemical vapor deposition chamber. the chemical vapor deposition chamber includes a spindle mechanism that cooperates with one or more carrier ring forks to move the semiconductor substrate from one station to another station. the methods include monitoring one or more spindle operation parameters and carrying out one or more maintenance steps on the spindle mechanism based on the results of monitoring the one or more spindle operation parameters. the monitored spindle operation parameters provide an indication of undesirable vibration of the semiconductor substrates in the processing chamber. the vibration of the semiconductor substrates in the processing chamber is undesirable because it promotes generation of unwanted particles that deposit onto a surface of the semiconductor substrate.
