Taiwan semiconductor manufacturing co., ltd. (20240221988). SLOW WAVE INDUCTIVE STRUCTURE simplified abstract
Contents
SLOW WAVE INDUCTIVE STRUCTURE
Organization Name
taiwan semiconductor manufacturing co., ltd.
Inventor(s)
Hsiao-Tsung Yen of Hsinchu (TW)
SLOW WAVE INDUCTIVE STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240221988 titled 'SLOW WAVE INDUCTIVE STRUCTURE
The semiconductor device described in the abstract consists of a first conductive winding over a first substrate, a second substrate bonded to the first substrate, a switch in the second substrate, an inter-level via (ILV) in the second substrate, and a second conductive winding over the second substrate.
- The first conductive winding is positioned over the first substrate.
- The second substrate is attached to the first substrate.
- A switch is located within the second substrate.
- An inter-level via (ILV) is present in the second substrate.
- The second conductive winding on the second substrate includes a conductive line around a central opening, with the switch connected on one side of the opening and the ILV connected on the opposite side.
Potential Applications: - Power electronics - Semiconductor industry - Electrical engineering
Problems Solved: - Efficient power distribution - Enhanced electrical connectivity - Improved semiconductor device performance
Benefits: - Increased efficiency - Enhanced reliability - Simplified design and manufacturing process
Commercial Applications: Title: "Innovative Semiconductor Device for Enhanced Power Distribution" This technology can be utilized in various commercial applications such as power supplies, electric vehicles, renewable energy systems, and industrial automation.
Questions about the technology: 1. How does the presence of the ILV in the second substrate impact the overall performance of the semiconductor device?
The ILV facilitates electrical connections between different layers of the device, improving signal transmission and efficiency.
2. What are the advantages of having a switch integrated into the second substrate of the semiconductor device?
The switch allows for control over the flow of electricity, enabling efficient power management and protection against electrical faults.
Original Abstract Submitted
a semiconductor device includes a first conductive winding over a first substrate. the semiconductor device further includes a second substrate bonded to the first substrate. the semiconductor device further includes a switch in the second substrate. the semiconductor device further includes an inter-level via (ilv) in the second substrate. the semiconductor device further includes a second conductive winding over the second substrate, wherein the second conductive winding includes a conductive line around a central opening, the switch is electrically connected to the second conductive winding on a first side of the opening, and the ilv is electrically connected to the second conductive winding on a second side of the opening opposite the first side.
