Taiwan semiconductor manufacturing co., ltd. (20240217054). CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD simplified abstract
Contents
CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD
Organization Name
taiwan semiconductor manufacturing co., ltd.
Inventor(s)
Shang-Yu Wang of Changhua County (TW)
Ching-Hsiang Tsai of Hsinchu (TW)
CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240217054 titled 'CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD
The method described in the abstract involves placing a polisher head on a platen, which includes a set of first magnets, and controlling a set of second magnets to rotate the polisher head on the platen. This control of the second magnets includes reversing the polarity of at least one second magnet to produce a magnetic force on at least one first magnet, with the second magnets being external to the polisher head.
- The method involves using a set of first magnets in a polisher head and a set of second magnets external to the polisher head to control the rotation of the polisher head on a platen.
- By reversing the polarity of at least one second magnet, a magnetic force is produced on at least one first magnet, allowing for precise control of the polisher head.
- This innovative method enables efficient and effective polishing processes by utilizing magnetic forces to manipulate the movement of the polisher head on the platen.
- The external placement of the second magnets provides flexibility and ease of control in rotating the polisher head, enhancing the overall polishing performance.
- The use of magnetic forces in this method offers a unique approach to polishing technology, potentially improving accuracy and consistency in polishing applications.
Potential Applications: - This method can be applied in semiconductor manufacturing processes for polishing wafers. - It can also be used in optical lens manufacturing for precise polishing of lenses. - The technology may find applications in the automotive industry for polishing metal parts.
Problems Solved: - Provides a more efficient and controlled method for polishing surfaces. - Offers a way to improve the accuracy and consistency of polishing processes. - Enhances the overall performance of polishing equipment.
Benefits: - Increased precision in polishing applications. - Improved control over the polishing process. - Potential for higher quality finished products.
Commercial Applications: Title: Innovative Magnetic Polishing Method for Precision Surface Finishing This technology can be utilized in industries such as semiconductor manufacturing, optics, and automotive for enhanced polishing processes. The precise control offered by the magnetic forces can lead to improved efficiency and quality in surface finishing applications.
Questions about Magnetic Polishing Method: 1. How does the use of magnetic forces in polishing processes improve efficiency and accuracy? 2. What are the potential cost-saving benefits of implementing this innovative method in industrial polishing applications?
Original Abstract Submitted
a method includes placing a polisher head on platen, the polisher head including a set of first magnets, and controlling a set of second magnets to rotate the polisher head on the platen, wherein controlling the set of second magnets includes reversing the polarity of at least one second magnet of the set of second magnets to produce a magnetic force on at least one first magnet of the set of first magnets, wherein the set of second magnets are external to the polisher head.
