Taiwan semiconductor manufacturing co., ltd. (20240217052). ZONE-BASED CMP TARGET CONTROL simplified abstract
Contents
ZONE-BASED CMP TARGET CONTROL
Organization Name
taiwan semiconductor manufacturing co., ltd.
Inventor(s)
Che-Liang Chung of Hsinchu (TW)
ZONE-BASED CMP TARGET CONTROL - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240217052 titled 'ZONE-BASED CMP TARGET CONTROL
The present disclosure involves techniques for zone-based target control in chemical mechanical polishing of wafers. Multiple zones are identified on the wafer's surface, and the CMP target is achieved on each zone in a sequence of CMP processes. Each CMP process in the sequence achieves the CMP target for only one zone, using a CMP process selective to other zones.
- The innovation involves identifying multiple zones on a wafer's surface for more precise CMP target control.
- The CMP target is achieved on each zone in a sequence of processes, ensuring efficient and effective polishing.
- Each CMP process in the sequence is selective to one zone, preventing interference with other zones and improving overall polishing quality.
- This technique allows for customized polishing of different areas on the wafer, enhancing overall wafer quality and yield.
- By targeting specific zones individually, this innovation optimizes the CMP process and reduces the risk of over-polishing or under-polishing.
Potential Applications: This technology can be applied in semiconductor manufacturing processes where precise polishing of wafers is crucial for device performance.
Problems Solved: This innovation addresses the challenge of achieving uniform polishing across different zones on a wafer, improving overall wafer quality and yield.
Benefits: - Enhanced control over CMP processes - Improved wafer quality and yield - Reduced risk of over-polishing or under-polishing
Commercial Applications: This technology can be utilized in semiconductor fabrication facilities to improve the efficiency and quality of wafer polishing processes.
Questions about Zone-Based Target Control in Chemical Mechanical Polishing of Wafers: 1. How does this innovation improve the overall quality of polished wafers? - This innovation allows for precise control over the CMP process in different zones on a wafer, resulting in improved uniformity and quality.
2. What are the potential challenges in implementing zone-based target control in CMP processes? - One potential challenge could be the need for advanced equipment and software to accurately identify and target specific zones on the wafer for polishing.
Original Abstract Submitted
the present disclosure is directed to techniques of zone-based target control in chemical mechanical polishing of wafers. multiple zones are identified on a surface of a wafer. the cmp target is achieved on each zone in a sequence of cmp processes. each cmp process in the sequence achieves the cmp target for only one zone, using a cmp process selective to other zones.
