Taiwan semiconductor manufacturing co., ltd. (20240194785). FINFET DEVICE simplified abstract

From WikiPatents
Jump to navigation Jump to search

FINFET DEVICE

Organization Name

taiwan semiconductor manufacturing co., ltd.

Inventor(s)

Chia Tai Lin of Taichung City (TW)

Yih-Ann Lin of Jhudong Township (TW)

An-Shen Chang of Jubei City (TW)

Ryan Chia-Jen Chen of Chiayi (TW)

Chao-Cheng Chen of Hsin-Chu City (TW)

FINFET DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240194785 titled 'FINFET DEVICE

The abstract describes a fin-type field-effect transistor (FinFET) device with multiple fins over a substrate, a dielectric layer filling the space between the fins, and a dielectric trench with a vertical profile. The device also features a second portion of the fins recessed and exposed in the dielectric trench, with a rounded-convex-shape top profile.

  • The semiconductor device includes multiple fins formed over a substrate.
  • A dielectric layer fills the space between the fins and covers a first portion of the fins.
  • A dielectric trench with a vertical profile is formed in the dielectric layer.
  • A second portion of the fins is recessed and exposed in the dielectric trench.
  • The second portion of the fins has a rounded-convex-shape top profile.

Potential Applications: - Advanced semiconductor devices - High-performance electronics - Next-generation computing systems

Problems Solved: - Enhanced performance and efficiency of field-effect transistors - Improved control over electrical properties - Reduction of leakage currents

Benefits: - Increased speed and reliability of electronic devices - Lower power consumption - Miniaturization of electronic components

Commercial Applications: Title: "Innovative FinFET Technology for High-Performance Electronics" This technology can be utilized in: - Smartphone processors - Data center servers - Automotive electronics

Prior Art: Researchers can explore prior patents related to FinFET technology, dielectric layers, and semiconductor device fabrication processes.

Frequently Updated Research: Researchers are continuously exploring ways to optimize FinFET structures for even higher performance and efficiency.

Questions about FinFET Technology: 1. How does the dielectric trench impact the performance of the FinFET device? 2. What are the key advantages of using a rounded-convex-shape top profile for the fins in this semiconductor device?


Original Abstract Submitted

a fin-type field-effect transistor (finfet) device includes a plurality of fins formed over a substrate. the semiconductor device further includes a dielectric layer filled in a space between each fin and over a first portion of the plurality of fins and a dielectric trench formed in the dielectric layer. the dielectric trench has a vertical profile. the semiconductor device further includes a second portion of the plurality of fins recessed and exposed in the dielectric trench. the second portion of the plurality of fins have a rounded-convex-shape top profile.