Taiwan semiconductor manufacturing co., ltd. (20240194765). Semiconductor Device and Method simplified abstract

Semiconductor Device and Method

Organization Name

taiwan semiconductor manufacturing co., ltd.

Inventor(s)

Yoh-Rong Liu of Taipei City (TW)

Wen-Kai Lin of Yilan County (TW)

Che-Hao Chang of Hsinchu (TW)

Chi On Chui of Hsinchu (TW)

Yung-Cheng Lu of Hsinchu (TW)

Li-Chi Yu of Jhubei City (TW)

Sen-Hong Syue of Zhubei City (TW)

Semiconductor Device and Method - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240194765 titled 'Semiconductor Device and Method

The method described in the patent application involves manufacturing a semiconductor device by forming a multi-layer stack of alternating first layers of a first semiconductor material and second layers of a second semiconductor material on a semiconductor substrate. This is followed by forming a first recess through the multi-layer stack and laterally recessing the sidewalls of the second layers of the multi-layer stack, which are adjacent to the first recess. Inner spacers with respective seams are then formed adjacent to the recessed second layers, and an anneal treatment is performed on the inner spacers to close the respective seams.

• Formation of a multi-layer stack with alternating layers of different semiconductor materials.
• Creation of a first recess through the multi-layer stack.
• Lateral recessing of the sidewalls of the second layers of the multi-layer stack.
• Formation of inner spacers with seams adjacent to the recessed second layers.
• Anneal treatment to close the seams of the inner spacers.

Potential Applications: - Semiconductor manufacturing - Integrated circuit fabrication - Electronic device production

Problems Solved: - Enhancing the performance and efficiency of semiconductor devices - Improving the manufacturing process of semiconductor components

Benefits: - Increased functionality of semiconductor devices - Enhanced reliability and durability of electronic components - Cost-effective manufacturing process

Commercial Applications: Title: Semiconductor Device Manufacturing Method for Enhanced Performance This technology can be utilized in the production of various semiconductor devices, including microprocessors, memory chips, and sensors. The improved manufacturing process can lead to more efficient and reliable electronic products, catering to a wide range of industries such as telecommunications, consumer electronics, and automotive.

Prior Art: Readers can explore prior patents related to semiconductor device manufacturing methods, specifically focusing on techniques for forming multi-layer stacks and enhancing the performance of semiconductor components.

Frequently Updated Research: Researchers are constantly exploring new materials and techniques to further improve the performance and efficiency of semiconductor devices. Stay updated on the latest advancements in semiconductor manufacturing for potential breakthroughs in the industry.

Questions about Semiconductor Device Manufacturing Method: 1. How does the formation of inner spacers contribute to the overall performance of the semiconductor device? 2. What are the specific semiconductor materials commonly used in the manufacturing process described in the patent application?

Original Abstract Submitted

a method of manufacturing a semiconductor device includes forming a multi-layer stack of alternating first layers of a first semiconductor material and second layers of a second semiconductor material on a semiconductor substrate, forming a first recess through the multi-layer stack, and laterally recessing sidewalls of the second layers of the multi-layer stack. the sidewalls are adjacent to the first recess. the method further includes forming inner spacers with respective seams adjacent to the recessed second layers of the multi-layer stack and performing an anneal treatment on the inner spacers to close the respective seams.