Taiwan semiconductor manufacturing co., ltd. (20240194716). TAPERED BACKSIDE GROUND STRUCTURE FOR PIXEL ARRAY simplified abstract
Contents
- 1 TAPERED BACKSIDE GROUND STRUCTURE FOR PIXEL ARRAY
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 TAPERED BACKSIDE GROUND STRUCTURE FOR PIXEL ARRAY - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Commercial Applications
- 1.9 Prior Art
- 1.10 Frequently Updated Research
- 1.11 Questions about Integrated Chips
- 1.12 Original Abstract Submitted
TAPERED BACKSIDE GROUND STRUCTURE FOR PIXEL ARRAY
Organization Name
taiwan semiconductor manufacturing co., ltd.
Inventor(s)
Yu-Wei Huang of Tainan City (TW)
Chen-Hsien Lin of Tainan City (TW)
Shyh-Fann Ting of Tainan City (TW)
TAPERED BACKSIDE GROUND STRUCTURE FOR PIXEL ARRAY - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240194716 titled 'TAPERED BACKSIDE GROUND STRUCTURE FOR PIXEL ARRAY
Simplified Explanation
The patent application describes an integrated chip with a semiconductor substrate and a pixel array containing photodetectors and transistors. A backside ground structure surrounds the pixel array with a sloped sidewall.
- The integrated chip includes a semiconductor substrate and a pixel array with photodetectors and transistors.
- A backside ground structure surrounds the pixel array with a sloped sidewall.
- The backside ground structure extends into the semiconductor substrate opposite the frontside.
Potential Applications
This technology could be used in:
- Image sensors
- Optical communication devices
- Medical imaging equipment
Problems Solved
- Improved signal processing in pixel arrays
- Enhanced performance of photodetectors
- Better integration of components in semiconductor devices
Benefits
- Higher quality images
- Increased sensitivity in detecting light
- More efficient semiconductor devices
Commercial Applications
- Manufacturing of digital cameras
- Development of security cameras
- Production of medical imaging devices
Prior Art
Readers can explore prior art related to integrated chips, semiconductor devices, and pixel arrays in the field of semiconductor technology.
Frequently Updated Research
Stay updated on advancements in semiconductor technology, image sensor development, and photodetector innovations.
Questions about Integrated Chips
What are the key components of an integrated chip?
An integrated chip typically includes a semiconductor substrate, pixel array, and various electronic components for signal processing.
How does the backside ground structure improve the performance of the pixel array?
The backside ground structure helps to reduce noise interference and improve the overall efficiency of the pixel array.
Original Abstract Submitted
some embodiments relate to an integrated chip including a semiconductor substrate and a pixel array comprising a plurality of photodetectors in the semiconductor substrate. the pixel array further comprises a plurality of transistors on a frontside of the semiconductor substrate. a backside ground (bsgd) structure extends into a backside of the semiconductor substrate, opposite the frontside, and further surrounding the pixel array along a periphery of the pixel array. the bsgd structure has a first sloped sidewall extending from a bottom surface of the bsgd structure that is recessed into the semiconductor substrate.
