Taiwan semiconductor manufacturing co., ltd. (20240194650). MULTI-WAFER INTEGRATION simplified abstract
Contents
- 1 MULTI-WAFER INTEGRATION
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 MULTI-WAFER INTEGRATION - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Key Features and Innovation
- 1.6 Potential Applications
- 1.7 Problems Solved
- 1.8 Benefits
- 1.9 Commercial Applications
- 1.10 Prior Art
- 1.11 Frequently Updated Research
- 1.12 Questions about Semiconductor Integration
- 1.13 Original Abstract Submitted
MULTI-WAFER INTEGRATION
Organization Name
taiwan semiconductor manufacturing co., ltd.
Inventor(s)
Chin-Min Lin of Hsinchu City (TW)
Dun-Nian Yaung of Taipei City (TW)
MULTI-WAFER INTEGRATION - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240194650 titled 'MULTI-WAFER INTEGRATION
Simplified Explanation
The patent application describes a method for forming semiconductor devices by bonding wafers containing electronic integrated circuits (EICs) and photonic integrated circuits (PICs) to create a stacked wafer with aligned EICs and PICs.
- The method involves forming a first wafer with EICs and a second wafer with PICs.
- The two wafers are bonded together, aligning each EIC with a corresponding PIC.
Key Features and Innovation
- Formation of a stacked wafer with both electronic and photonic integrated circuits.
- Vertical alignment of EICs with PICs during bonding process.
Potential Applications
The technology can be used in the development of advanced semiconductor devices for various applications such as telecommunications, data processing, and sensing technologies.
Problems Solved
- Integration of electronic and photonic components in a single device.
- Alignment of EICs and PICs to optimize performance.
Benefits
- Enhanced functionality and performance of semiconductor devices.
- Improved efficiency in data processing and communication.
Commercial Applications
- Potential commercial applications include high-speed data processing systems, optical communication networks, and sensor devices for various industries.
Prior Art
Readers can explore prior art related to semiconductor integration technologies, wafer bonding methods, and advancements in electronic and photonic integration.
Frequently Updated Research
Stay informed about the latest research on semiconductor integration, wafer bonding techniques, and advancements in photonic and electronic device integration.
Questions about Semiconductor Integration
What are the key challenges in aligning electronic and photonic components in semiconductor devices?
Aligning electronic and photonic components in semiconductor devices can be challenging due to differences in materials, processes, and design requirements. Precise alignment is crucial for optimal device performance and functionality.
How does the integration of electronic and photonic components benefit semiconductor devices?
Integrating electronic and photonic components in semiconductor devices enables enhanced functionality, improved performance, and increased efficiency in data processing, communication, and sensing applications.
Original Abstract Submitted
semiconductor devices and methods of forming the same are provided. a method according to the present disclosure includes forming a first wafer including a plurality of electronic integrated circuits (eics), forming a second wafer including a plurality of photonic integrated circuits (pics), bonding the first wafer to the second wafer to form a first stacked wafer. the bonding of the first wafer to the second wafer includes vertically aligning each of the plurality of the eics with one of the plurality of the pics.
