Taiwan semiconductor manufacturing co., ltd. (20240194619). PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract
Contents
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
Organization Name
taiwan semiconductor manufacturing co., ltd.
Inventor(s)
Sen-Kuei Hsu of Kaohsiung City (TW)
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240194619 titled 'PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
The abstract describes a package structure that includes a redistribution circuit structure, a semiconductor die, a waveguide structure, and an antenna. The semiconductor die is sandwiched between and electrically coupled to the first and second redistribution circuit structures. The waveguide structure is located aside and electrically coupled to the semiconductor die, with the antenna located on the semiconductor die and electrically communicated with it through the waveguide structure.
- The package structure includes a redistribution circuit structure, a semiconductor die, a waveguide structure, and an antenna.
- The semiconductor die is sandwiched between and electrically coupled to the first and second redistribution circuit structures.
- The waveguide structure is located aside and electrically coupled to the semiconductor die, including a part of the redistribution circuit structures and a plurality of vias connecting them.
- The antenna is located on the semiconductor die and electrically communicated with it through the waveguide structure.
Potential Applications: - This technology could be used in wireless communication systems. - It could also be applied in radar systems for military or civilian purposes.
Problems Solved: - Provides a compact and efficient way to integrate semiconductor dies with antennas. - Enables better signal transmission and reception in communication systems.
Benefits: - Improved signal quality and reliability. - Space-saving design for compact electronic devices.
Commercial Applications: Title: Integration of Semiconductor Die with Antenna for Enhanced Wireless Communication Systems This technology could be utilized in the development of advanced smartphones, IoT devices, and satellite communication systems, enhancing their performance and reliability in signal transmission and reception.
Prior Art: Prior research in the field of integrated circuit packaging and antenna design could provide insights into similar approaches to combining semiconductor dies with antennas.
Frequently Updated Research: Researchers are continually exploring new materials and manufacturing techniques to further enhance the performance and efficiency of integrated circuit packages with integrated antennas.
Questions about Integration of Semiconductor Die with Antenna: 1. How does this technology improve signal transmission in wireless communication systems? 2. What are the potential challenges in manufacturing and integrating semiconductor dies with antennas in a compact package?
Original Abstract Submitted
a package structure includes a first redistribution circuit structure, a second redistribution circuit structure, a semiconductor die, a waveguide structure, and an antenna. the semiconductor die is sandwiched between and electrically coupled to the first redistribution circuit structure and the second redistribution circuit structure. the waveguide structure is located aside and electrically coupled to the semiconductor die, wherein the waveguide structure includes a part of the first redistribution circuit structure, a part of the second redistribution circuit structure and a plurality of first through vias each connecting to the part of the first redistribution circuit structure and the part of the second redistribution circuit structure. the antenna is located on the semiconductor die, wherein the second redistribution circuit structure is sandwiched between the antenna and the semiconductor die, and the antenna is electrically communicated with the semiconductor die through the waveguide structure.
