Taiwan semiconductor manufacturing co., ltd. (20240194611). SEMICONDUCTOR PACKAGE AND METHOD simplified abstract
Contents
- 1 SEMICONDUCTOR PACKAGE AND METHOD
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGE AND METHOD - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Key Features and Innovation
- 1.6 Potential Applications
- 1.7 Problems Solved
- 1.8 Benefits
- 1.9 Commercial Applications
- 1.10 Prior Art
- 1.11 Frequently Updated Research
- 1.12 Questions about Integrated Circuit Packaging
- 1.13 Original Abstract Submitted
SEMICONDUCTOR PACKAGE AND METHOD
Organization Name
taiwan semiconductor manufacturing co., ltd.
Inventor(s)
SEMICONDUCTOR PACKAGE AND METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240194611 titled 'SEMICONDUCTOR PACKAGE AND METHOD
Simplified Explanation
The patent application describes a device with an integrated circuit die encapsulated in a molding compound, a through via adjacent to the die, and a redistribution structure over the die, compound, and via.
- The device includes a molding compound, an integrated circuit die, a through via, and a redistribution structure.
- The redistribution structure consists of multiple layers of dielectric and conductive vias.
- The interface between the conductive vias is non-planar, providing unique electrical connections within the device.
Key Features and Innovation
- Device with integrated circuit die encapsulated in molding compound.
- Through via adjacent to the integrated circuit die.
- Redistribution structure over the die, compound, and via.
- Non-planar interface between conductive vias in the redistribution structure.
Potential Applications
This technology can be applied in various electronic devices requiring compact and efficient integrated circuits.
Problems Solved
- Provides a compact and efficient way to connect integrated circuit dies.
- Enhances electrical connections within the device.
- Improves overall performance and reliability of electronic devices.
Benefits
- Compact design for integrated circuits.
- Enhanced electrical connectivity.
- Improved performance and reliability of electronic devices.
Commercial Applications
Potential commercial applications include semiconductor manufacturing, consumer electronics, telecommunications, and automotive industries.
Prior Art
Readers can explore prior patents related to integrated circuit packaging and redistribution structures to understand the evolution of this technology.
Frequently Updated Research
Stay updated on advancements in integrated circuit packaging and redistribution structures to leverage the latest innovations in electronic device manufacturing.
Questions about Integrated Circuit Packaging
What are the key advantages of using a redistribution structure in integrated circuit packaging?
A redistribution structure allows for efficient routing of signals, reducing signal interference and improving overall performance of the integrated circuit.
How does the non-planar interface between conductive vias in the redistribution structure impact the electrical connections within the device?
The non-planar interface ensures reliable electrical connections between different layers of the redistribution structure, enhancing the overall functionality of the device.
Original Abstract Submitted
in an embodiment, a device includes: a molding compound; an integrated circuit die encapsulated in the molding compound; a through via adjacent the integrated circuit die; and a redistribution structure over the integrated circuit die, the molding compound, and the through via, the redistribution structure electrically connected to the integrated circuit die and the through via, the redistribution structure including: a first dielectric layer disposed over the molding compound; a first conductive via extending through the first dielectric layer; a second dielectric layer disposed over the first dielectric layer and the first conductive via; and a second conductive via extending through the second dielectric layer and into a portion of the first conductive via, an interface between the first conductive via and the second conductive via being non-planar.
