Taiwan semiconductor manufacturing co., ltd. (20240194591). PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME simplified abstract

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

Organization Name

taiwan semiconductor manufacturing co., ltd.

Inventor(s)

Chih-Hsuan Tai of Taipei City (TW)

Hao-Yi Tsai of Hsinchu City (TW)

Tsung-Hsien Chiang of Hsinchu (TW)

Yu-Chih Huang of Hsinchu (TW)

Chia-Hung Liu of Hsinchu City (TW)

Ban-Li Wu of Hsinchu City (TW)

Ying-Cheng Tseng of Tainan City (TW)

Po-Chun Lin of Hsinchu (TW)

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240194591 titled 'PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

The patent application describes a package structure with a thermal dissipation structure that includes a substrate, a first encapsulant covering the substrate, a die with a sensing region, a second encapsulant covering the die, and a redistribution structure on top of the die and second encapsulant. The die is connected to the substrate through the redistribution structure, which features a hollow region over the sensing region of the die.

• The package structure includes a thermal dissipation structure with a unique layout to efficiently dissipate heat.
• The redistribution structure allows for electrical connection between the die and substrate while providing thermal management.
• The hollow region in the redistribution structure enhances heat dissipation by allowing for better airflow over the sensing region of the die.

Potential Applications: - Electronic devices requiring efficient thermal management. - High-performance computing systems. - Automotive electronics where heat dissipation is crucial.

Problems Solved: - Improved thermal dissipation in compact electronic devices. - Enhanced reliability and performance of electronic components.

Benefits: - Increased longevity of electronic devices. - Improved overall performance due to better heat management. - Enhanced reliability in demanding operating conditions.

Commercial Applications: Title: Advanced Thermal Management Package Structure for Electronics This technology can be used in various commercial applications such as: - Consumer electronics - Automotive industry - Aerospace and defense sector

Prior Art: Readers can explore prior research on thermal dissipation structures in electronic packaging to understand the evolution of this technology.

Frequently Updated Research: Stay updated on the latest advancements in thermal management techniques for electronic devices to ensure optimal performance and reliability.

Questions about Advanced Thermal Management Package Structure for Electronics: 1. How does the redistribution structure contribute to both electrical connectivity and thermal management in the package structure? 2. What are the key advantages of having a hollow region in the redistribution structure for heat dissipation?

Original Abstract Submitted

a package structure includes a thermal dissipation structure including a substrate, a first encapsulant laterally covering the substrate, a die disposed on the substrate and including a sensing region, a second encapsulant laterally covering the die, and a redistribution structure disposed on the die and the second encapsulant. an outer sidewall of the second encapsulant is laterally offset from an outer sidewall of the first encapsulant. the die is electrically coupled to the substrate through the redistribution structure, and the redistribution structure includes a hollow region overlying the sensing region of the die.