Taiwan semiconductor manufacturing co., ltd. (20240194556). SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract
Contents
- 1 SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Key Features and Innovation
- 1.6 Potential Applications
- 1.7 Problems Solved
- 1.8 Benefits
- 1.9 Commercial Applications
- 1.10 Prior Art
- 1.11 Frequently Updated Research
- 1.12 Questions about Semiconductor Packaging
- 1.13 Original Abstract Submitted
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Organization Name
taiwan semiconductor manufacturing co., ltd.
Inventor(s)
Meng-Liang Lin of Hsinchu (TW)
Po-Yao Chuang of Hsin-Chu (TW)
Shuo-Mao Chen of New Taipei City (TW)
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240194556 titled 'SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Simplified Explanation
The semiconductor package described in the patent application includes a circuit substrate with a cavity, a semiconductor die, and a filling material. The semiconductor die is placed in the cavity and connected to the circuit substrate, with the filling material encapsulating the die to attach it to the substrate.
Key Features and Innovation
- Circuit substrate with a cavity concave from the first surface.
- Metal floor plate embedded in the dielectric material below the cavity.
- Semiconductor die electrically connected to the circuit substrate.
- Filling material filling the cavity and encapsulating the semiconductor die.
Potential Applications
This technology can be used in various semiconductor packaging applications where a secure and reliable connection between the semiconductor die and the circuit substrate is required.
Problems Solved
This technology addresses the need for a robust and efficient method of attaching semiconductor dies to circuit substrates in semiconductor packaging.
Benefits
- Secure attachment of semiconductor die to circuit substrate.
- Improved reliability and performance of semiconductor packages.
- Enhanced protection for the semiconductor die.
Commercial Applications
Title: Advanced Semiconductor Packaging Technology for Enhanced Performance This technology can be applied in industries such as electronics, telecommunications, automotive, and aerospace for the production of high-performance semiconductor devices.
Prior Art
Readers interested in prior art related to this technology can explore patents and research papers on semiconductor packaging methods, die attachment techniques, and materials used in semiconductor packaging.
Frequently Updated Research
Researchers are constantly exploring new materials and techniques to further improve the performance and reliability of semiconductor packaging technologies.
Questions about Semiconductor Packaging
What are the key components of a semiconductor package?
A semiconductor package typically includes a circuit substrate, a semiconductor die, and various materials for encapsulation and connection.
How does the filling material in the semiconductor package contribute to its performance?
The filling material in the semiconductor package helps to secure the semiconductor die in place, provide electrical connections, and protect the die from external factors.
Original Abstract Submitted
a semiconductor package and a manufacturing method thereof are provided. the semiconductor package includes at least a circuit substrate, a semiconductor die and a filling material. the circuit substrate has a first surface, a second surface opposite to the first surface and a cavity concave from the first surface. the circuit substrate includes a dielectric material and a metal floor plate embedded in the dielectric material and located below the cavity. a location of the metal floor plate corresponds to a location of the cavity. the metal floor plate is electrically floating and isolated by the dielectric material. the semiconductor die is disposed in the cavity and electrically connected with the circuit substrate. the filling material is disposed between the semiconductor die and the circuit substrate. the filling material fills the cavity and encapsulates the semiconductor die to attach the semiconductor die and the circuit substrate.
