Taiwan semiconductor manufacturing co., ltd. (20240194523). SELECTIVE DEPOSITION OF A PROTECTIVE LAYER TO REDUCE INTERCONNECT STRUCTURE CRITICAL DIMENSIONS simplified abstract

SELECTIVE DEPOSITION OF A PROTECTIVE LAYER TO REDUCE INTERCONNECT STRUCTURE CRITICAL DIMENSIONS

Organization Name

taiwan semiconductor manufacturing co., ltd.

Inventor(s)

Hsi-Wen Tien of Xinfeng Township (TW)

Chung-Ju Lee of Hsinchu City (TW)

Chih Wei Lu of Hsinchu City (TW)

Hsin-Chieh Yao of Hsinchu City (TW)

Yu-Teng Dai of New Taipei City (TW)

Wei-Hao Liao of Taichung City (TW)

SELECTIVE DEPOSITION OF A PROTECTIVE LAYER TO REDUCE INTERCONNECT STRUCTURE CRITICAL DIMENSIONS - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240194523 titled 'SELECTIVE DEPOSITION OF A PROTECTIVE LAYER TO REDUCE INTERCONNECT STRUCTURE CRITICAL DIMENSIONS

Simplified Explanation

The patent application describes an integrated chip with a protective layer surrounding an interconnect via and wire, allowing for efficient communication within the chip.

• The integrated chip includes an interconnect dielectric layer over a substrate.
• An interconnect via is within the interconnect dielectric layer.
• An interconnect wire is over the interconnect via and within the interconnect dielectric layer.
• A protective layer surrounds the interconnect via.
• The protective layer extends from the outer sidewall of the interconnect via to the outer sidewall of the interconnect wire.

Potential Applications

This technology can be applied in various electronic devices such as smartphones, computers, and other integrated circuits where efficient communication between components is crucial.

Problems Solved

This technology addresses the need for reliable and efficient communication pathways within integrated chips, ensuring optimal performance and functionality.

Benefits

The integrated chip with the protective layer enhances the durability and reliability of the interconnect via and wire, leading to improved overall performance of electronic devices.

Commercial Applications

• Semiconductor industry: This technology can be utilized in the production of advanced integrated circuits for various electronic devices.
• Telecommunications sector: The improved communication pathways can enhance the performance of communication equipment.

Prior Art

Readers can explore prior patents related to integrated circuits, interconnect technologies, and protective layers in semiconductor devices to gain a deeper understanding of the existing knowledge in this field.

Frequently Updated Research

Stay updated on the latest advancements in interconnect technologies, semiconductor manufacturing processes, and protective coatings for electronic components to further enhance the efficiency and reliability of integrated chips.

Questions about Integrated Chip Technology

What are the key features of an integrated chip with a protective layer?

The key features include an interconnect dielectric layer, interconnect via, interconnect wire, and a protective layer surrounding the interconnect via and wire.

How does the protective layer improve the performance of the integrated chip?

The protective layer enhances the durability and reliability of the interconnect via and wire, ensuring efficient communication pathways within the chip.

Original Abstract Submitted

in some embodiments, the present disclosure relates to an integrated chip. the integrated chip includes an interconnect dielectric layer over a substrate. an interconnect via is within the interconnect dielectric layer, and an interconnect wire is over the interconnect via and within the interconnect dielectric layer. a protective layer surrounds the interconnect via. the interconnect via vertically extends through the protective layer to below a bottom of the protective layer. the protective layer continuously extends from along an outer sidewall of the interconnect via to along an outer sidewall of the interconnect wire in a first cross-sectional view.