Taiwan semiconductor manufacturing co., ltd. (20240192588). METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Organization Name

taiwan semiconductor manufacturing co., ltd.

Inventor(s)

Chih-Tsung Shih of Hsinchu City (TW)

Tsung-Chih Chien of Caotun Township (TW)

Tsung Chuan Lee of Taipei City (TW)

Hao-Shiang Chang of Hsinchu (TW)

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240192588 titled 'METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

The patent application describes a reticle enclosure that includes a base and a cover forming an internal space to secure a reticle, with structures limiting the passage of contaminants.

• The reticle enclosure includes restraining mechanisms to secure the reticle in place.
• Structures are arranged to enclose the reticle partially and prevent contaminants from entering the internal space.
• Barriers on the first and second surfaces help contain the reticle within the enclosure.
• Padding is installed in gaps between the barriers and surfaces for added protection.
• Wall structures between the restraining mechanisms further enhance the containment of the reticle.

Potential Applications

The reticle enclosure technology can be used in semiconductor manufacturing, lithography processes, and other industries requiring precise optical components.

Problems Solved

This innovation addresses the issue of contamination and damage to delicate reticles during storage and transportation.

Benefits

The reticle enclosure ensures the protection and integrity of the reticle, leading to improved manufacturing processes and product quality.

Commercial Applications

"Advanced Reticle Enclosure Technology for Semiconductor Manufacturing and Lithography Processes"

This technology can be commercially applied in semiconductor fabrication facilities, optical instrument manufacturing, and research institutions requiring precise optical equipment.

Prior Art

Readers can explore prior patents related to reticle enclosures, semiconductor manufacturing equipment, and contamination control in optical systems.

Frequently Updated Research

Stay updated on advancements in reticle enclosure technology, contamination control methods, and semiconductor manufacturing processes for the latest developments in the field.

Questions about Reticle Enclosure Technology

What are the key features of a reticle enclosure?

A reticle enclosure includes restraining mechanisms, structures to limit contaminant passage, barriers, and padding for protection.

How does the reticle enclosure technology benefit semiconductor manufacturing?

The technology ensures the integrity of reticles, leading to improved manufacturing processes and product quality.

Original Abstract Submitted

a reticle enclosure includes a base including a first surface, a cover including a second surface and coupled to the base with the first surface facing the second surface. the base and the cover form an internal space that includes a reticle. the reticle enclosure includes restraining mechanisms arranged in the internal space and for securing the reticle, and structures disposed adjacent the reticle in the internal space. the structures enclose the reticle at least partially, and limit passage of contaminants between the internal space and an external environment of the reticle enclosure. the structures include barriers disposed on the first and second surfaces. in other examples, a padding is installed in gaps between the barriers and the first and second surfaces. in other examples, the structures include wall structures disposed on the first and second surfaces and between the restraining mechanisms.