Taiwan semiconductor manufacturing co., ltd. (20240192456). Photonic Semiconductor Device and Method of Manufacture simplified abstract

Photonic Semiconductor Device and Method of Manufacture

Organization Name

taiwan semiconductor manufacturing co., ltd.

Inventor(s)

Chung-Ming Weng of Hsinchu (TW)

Chen-Hua Yu of Hsinchu (TW)

Chung-Shi Liu of Hsinchu (TW)

Hao-Yi Tsai of Hsinchu (TW)

Cheng-Chieh Hsieh of Tainan (TW)

Hung-Yi Kuo of Taipei (TW)

Tsung-Yuan Yu of Taipei (TW)

Hua-Kuei Lin of Hsinchu (TW)

Che-Hsiang Hsu of Taichung (TW)

Photonic Semiconductor Device and Method of Manufacture - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240192456 titled 'Photonic Semiconductor Device and Method of Manufacture

The patent application describes a package that includes a photonic layer on a substrate, with a silicon waveguide coupled to a grating coupler, an interconnect structure, an electronic die connected to the interconnect structure, a first dielectric layer, a first substrate bonded to the electronic die and the first dielectric layer, a socket attached to the first substrate, and a fiber holder coupled to the first substrate through the socket, with a prism that re-orients the optical path of an optical signal.

• Silicon waveguide coupled to a grating coupler
• Interconnect structure over the photonic layer
• Electronic die connected to the interconnect structure
• First substrate bonded to the electronic die and first dielectric layer
• Socket attached to the first substrate
• Fiber holder with a prism re-orienting the optical path

Potential Applications: - Data communication systems - Telecommunication networks - Optical signal processing devices

Problems Solved: - Efficient optical signal transmission - Integration of electronic and photonic components - Precise re-orientation of optical paths

Benefits: - Improved signal quality - Enhanced data transmission speeds - Compact and integrated design

Commercial Applications: - Optical communication equipment manufacturing - Telecommunication infrastructure development - Data center networking solutions

Prior Art: Prior art related to this technology may include patents or research papers on integrated photonics packaging, silicon waveguides, and optical interconnect technologies.

Frequently Updated Research: Research on advancements in silicon photonics, integrated photonics packaging, and optical signal processing techniques may be relevant to this technology.

Questions about the Technology: 1. How does the integration of electronic and photonic components improve signal transmission efficiency? 2. What are the key advantages of using a silicon waveguide coupled to a grating coupler in this package design?

Original Abstract Submitted

a package includes a photonic layer on a substrate, the photonic layer including a silicon waveguide coupled to a grating coupler; an interconnect structure over the photonic layer; an electronic die and a first dielectric layer over the interconnect structure, where the electronic die is connected to the interconnect structure; a first substrate bonded to the electronic die and the first dielectric layer; a socket attached to a top surface of the first substrate; and a fiber holder coupled to the first substrate through the socket, where the fiber holder includes a prism that re-orients an optical path of an optical signal.