Taiwan semiconductor manufacturing co., ltd. (20240190701). METHODS FOR WAFER BONDING simplified abstract
Contents
- 1 METHODS FOR WAFER BONDING
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 METHODS FOR WAFER BONDING - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Key Features and Innovation
- 1.6 Potential Applications
- 1.7 Problems Solved
- 1.8 Benefits
- 1.9 Commercial Applications
- 1.10 Prior Art
- 1.11 Frequently Updated Research
- 1.12 Questions about Wafer Bonding
- 1.13 Original Abstract Submitted
METHODS FOR WAFER BONDING
Organization Name
taiwan semiconductor manufacturing co., ltd.
Inventor(s)
Chien-Wei Chang of Hsin-Chu (TW)
Ren-Dou Lee of Hsinchu City (TW)
Yi-Chih Chang of Hsin-Chu (TW)
Yi-Hsun Chiu of Zhubei City (TW)
Yuan-Hsin Chi of Taichung County (TW)
METHODS FOR WAFER BONDING - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240190701 titled 'METHODS FOR WAFER BONDING
Simplified Explanation
This patent application discloses methods for improving wafer bonding performance, specifically focusing on bonding a pair of semiconductor substrates through a series of processing steps including chemical vapor deposition (CVD) and chemical mechanical polishing (CMP).
- The method involves processing each semiconductor substrate with at least one CVD and at least one CMP step before bonding them together.
- One CVD step is performed after all CMP steps are completed but before the bonding process.
Key Features and Innovation
- Utilizes a combination of CVD and CMP processes to enhance the bonding performance of semiconductor substrates.
- Sequential processing steps ensure optimal surface conditions for bonding.
- Improves the overall quality and reliability of wafer bonding in semiconductor manufacturing.
Potential Applications
- Semiconductor industry for manufacturing integrated circuits and other electronic devices.
- MEMS (Micro-Electro-Mechanical Systems) fabrication.
- Optoelectronics for producing photonic devices.
Problems Solved
- Enhances the bonding strength and uniformity between semiconductor substrates.
- Minimizes defects and imperfections in the bonding interface.
- Improves the overall yield and performance of semiconductor devices.
Benefits
- Increased reliability and durability of bonded semiconductor substrates.
- Enhanced electrical and mechanical properties of the bonded structures.
- Cost-effective manufacturing process with improved efficiency.
Commercial Applications
Wafer bonding technology can be applied in the production of advanced semiconductor devices, MEMS sensors, and optoelectronic components, catering to industries such as telecommunications, automotive, and consumer electronics.
Prior Art
Readers interested in exploring prior art related to wafer bonding techniques can refer to research papers, patents, and industry publications on semiconductor manufacturing processes, CVD, CMP, and wafer bonding technologies.
Frequently Updated Research
Researchers are continually exploring new materials, processes, and equipment to further enhance wafer bonding techniques and optimize semiconductor device performance. Stay updated on the latest advancements in CVD, CMP, and wafer bonding technologies for potential future applications and improvements.
Questions about Wafer Bonding
What are the key challenges in achieving a strong and reliable bond between semiconductor substrates?
Achieving a strong and reliable bond between semiconductor substrates involves overcoming challenges such as surface contamination, mismatched crystal structures, and thermal expansion coefficients. Proper surface preparation and bonding techniques are essential to address these challenges and ensure a robust bond.
How does the sequential processing of CVD and CMP steps contribute to the overall bonding performance of semiconductor substrates?
The sequential processing of CVD and CMP steps plays a crucial role in optimizing the surface conditions of semiconductor substrates before bonding. CVD helps deposit uniform and high-quality films on the substrate surfaces, while CMP removes any imperfections or roughness, resulting in improved bonding strength and uniformity.
Original Abstract Submitted
methods for improving wafer bonding performance are disclosed herein. in some embodiments, a method for bonding a pair of semiconductor substrates is disclosed. the method includes: processing at least one of the pair of semiconductor substrates, and bonding the pair of semiconductor substrates together. each of the pair of semiconductor substrates is processed by: performing at least one chemical vapor deposition (cvd), and performing at least one chemical mechanical polishing (cmp). one of the at least one cvd is performed after all cmp performed before bonding.
