Taiwan semiconductor manufacturing co., ltd. (20240186356). IMAGE SENSOR simplified abstract

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IMAGE SENSOR

Organization Name

taiwan semiconductor manufacturing co., ltd.

Inventor(s)

Min-Feng Kao of Chiayi City (TW)

Dun-Nian Yaung of Taipei City (TW)

Jen-Cheng Liu of Hsin-Chu City (TW)

Wen-Chang Kuo of Tainan City (TW)

Sheng-Chau Chen of Tainan City (TW)

Feng-Chi Hung of Hsin-Chu County (TW)

Sheng-Chan Li of Tainan CIty (TW)

IMAGE SENSOR - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240186356 titled 'IMAGE SENSOR

Simplified Explanation

Simplified Explanation

The patent application describes image sensors and methods for forming them, including a semiconductor device with metal isolation features, a metal grid, and microlens features.

  • A semiconductor device with a semiconductor layer.
  • Metal isolation features in the semiconductor layer.
  • A metal grid directly over the metal isolation features.
  • Microlens features over the metal grid.

Potential Applications

This technology can be used in various applications such as digital cameras, smartphones, security cameras, and medical imaging devices.

Problems Solved

The technology addresses the need for improved image sensor performance, particularly in terms of light sensitivity and image quality.

Benefits

The benefits of this technology include enhanced image quality, improved light sensitivity, and potentially smaller and more efficient image sensors.

Commercial Applications

  • Title: "Innovative Image Sensor Technology for Enhanced Performance"
  • This technology can be commercially applied in the consumer electronics industry for manufacturing high-quality cameras and imaging devices.
  • It can also be used in the medical field for diagnostic imaging equipment.

Prior Art

Information on prior art related to this specific technology is not provided in the abstract.

Frequently Updated Research

There is ongoing research in the field of image sensor technology, with advancements being made in improving sensor performance and image quality.

Unanswered Questions

Question 1

How does this technology compare to existing image sensor technologies in terms of performance and cost? This technology offers improved image quality and light sensitivity, but further research is needed to determine its cost-effectiveness compared to other sensor technologies.

Question 2

What are the potential challenges in implementing this technology on a large scale in commercial products? One potential challenge could be the scalability of production processes to meet the demand for image sensors in various consumer electronics and medical devices.


Original Abstract Submitted

image sensors and methods for forming the same are provided. a semiconductor device according to the present disclosure includes a semiconductor layer, a plurality of metal isolation features disposed in the semiconductor layer, a metal grid disposed directly over the plurality of metal isolation features, and a plurality of microlens features disposed over the metal grid.