Taiwan semiconductor manufacturing co., ltd. (20240186308). SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Organization Name

taiwan semiconductor manufacturing co., ltd.

Inventor(s)

Kai-Fung Chang of Hsinchu (TW)

Chin-Wei Liang of Hsinchu (TW)

Sheng-Feng Weng of Hsinchu (TW)

Ming-Yu Yen of Hsinchu (TW)

CHEYU Liu of Hsinchu (TW)

Hung-Chih Chen of Hsinchu (TW)

Yi-Yang Lei of Hsinchu (TW)

CHING-HUA Hsieh of Hsinchu (TW)

Hung-Chou Liao of Hsinchu (TW)

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240186308 titled 'SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Simplified Explanation

The semiconductor device described in the patent application includes multiple modules and a molding material that covers and surrounds them. This device is designed to improve the performance and reliability of semiconductor components.

• The semiconductor device consists of a redistribution layer (RDL) module, a first semiconductor module, an interconnection module, a second semiconductor module, and a molding material.
• The first semiconductor module is placed on the RDL module, while the interconnection module is positioned on top of the RDL module.
• The second semiconductor module is located on the interconnection module, and the molding material covers the entire structure, exposing the top surfaces of the semiconductor modules.

Key Features and Innovation

• Integration of multiple semiconductor modules with an interconnection module for enhanced performance.
• Use of a molding material to protect and encapsulate the semiconductor components.
• Exposed top surfaces of the semiconductor modules for accessibility and functionality.

Potential Applications

The technology can be applied in various semiconductor devices, including microprocessors, memory chips, and integrated circuits.

Problems Solved

• Enhanced performance and reliability of semiconductor components.
• Improved protection and encapsulation of semiconductor modules.

Benefits

• Increased efficiency and functionality of semiconductor devices.
• Enhanced durability and longevity of semiconductor components.

Commercial Applications

Title: "Advanced Semiconductor Device for Improved Performance" This technology can be utilized in the manufacturing of consumer electronics, automotive electronics, and industrial automation systems. It has the potential to revolutionize the semiconductor industry by offering more reliable and efficient components.

Prior Art

There is limited information available on prior art related to this specific semiconductor device design.

Frequently Updated Research

Currently, there are ongoing research efforts to further optimize the design and materials used in semiconductor devices for improved performance and reliability.

Unanswered Questions

Question 1

How does the use of a molding material impact the thermal management of the semiconductor device?

Question 2

What are the potential challenges in scaling up production of semiconductor devices with multiple modules and molding materials?

Original Abstract Submitted

a semiconductor device and a manufacturing method thereof are provided. the semiconductor device includes a redistribution layer (rdl) module, a first semiconductor module, an interconnection module, a second semiconductor module and a molding material. the first semiconductor module is disposed on the rdl module. the interconnection module is disposed on the rdl module. the second semiconductor module is disposed on the interconnection module. the molding material covers the rdl module and surrounds the first semiconductor module and the second semiconductor module. a top surface of the first semiconductor module and a top surface of the second semiconductor module are exposed by the molding material.