Taiwan semiconductor manufacturing co., ltd. (20240186276). Honeycomb Pattern for Conductive Features simplified abstract
Contents
- 1 Honeycomb Pattern for Conductive Features
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 Honeycomb Pattern for Conductive Features - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Simplified Explanation
- 1.6 Key Features and Innovation
- 1.7 Potential Applications
- 1.8 Problems Solved
- 1.9 Benefits
- 1.10 Commercial Applications
- 1.11 Prior Art
- 1.12 Frequently Updated Research
- 1.13 Unanswered Questions
- 1.14 Original Abstract Submitted
Honeycomb Pattern for Conductive Features
Organization Name
taiwan semiconductor manufacturing co., ltd.
Inventor(s)
Shenggao Li of Cupertino CA (US)
Honeycomb Pattern for Conductive Features - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240186276 titled 'Honeycomb Pattern for Conductive Features
Simplified Explanation
Simplified Explanation
The method involves forming a package component with electrical connectors in a honeycomb pattern, and bonding it to another package component with a second set of connectors.
- The method includes forming a first package component with a honeycomb pattern of electrical connectors.
- A second package component is bonded to the first one, with a second set of connectors.
- The second set of connectors at the second surface of the second package component are bonded to the first set of connectors.
Key Features and Innovation
- Innovative layout of electrical connectors in a honeycomb pattern.
- Bonding of two package components with different sets of connectors.
- Efficient electrical connection design.
Potential Applications
This technology can be applied in:
- Electronics manufacturing.
- Circuit board assembly.
- Aerospace industry for compact electrical connections.
Problems Solved
- Simplifies the process of connecting electrical components.
- Provides a more efficient layout for electrical connectors.
- Enhances the reliability of electrical connections.
Benefits
- Improved efficiency in electrical connection design.
- Enhanced reliability of electrical connections.
- Simplified manufacturing process for electronic devices.
Commercial Applications
- This technology can be utilized in the electronics industry for manufacturing compact and reliable electronic devices.
Prior Art
No prior art information available at this time.
Frequently Updated Research
No frequently updated research available at this time.
Unanswered Questions
Question 1
How does the honeycomb pattern of electrical connectors improve the efficiency of the electrical connections?
The honeycomb pattern allows for a more compact layout of connectors, reducing the space needed for connections and potentially improving signal integrity.
Question 2
What are the potential challenges in implementing this bonding method in mass production?
Potential challenges may include ensuring precise alignment of the connectors during bonding and maintaining consistent quality control throughout the manufacturing process.
Original Abstract Submitted
a method includes forming a first package component, and forming a first plurality of electrical connectors at a first surface of the first package component. the first plurality of electrical connectors are laid out as having a honeycomb pattern. a second package component is bonded to the first package component, wherein a second plurality of electrical connectors at a second surface of the second package component are bonded to the first plurality of electrical connectors.
