Taiwan semiconductor manufacturing co., ltd. (20240186257). SEMICONDUCTOR DEVICE simplified abstract

SEMICONDUCTOR DEVICE

Organization Name

taiwan semiconductor manufacturing co., ltd.

Inventor(s)

Meng-Che Tu of Hsinchu (TW)

Po-Nan Yeh of Hsinchu (TW)

Miao-Ken Hung of Hsinchu (TW)

Po-Han Wang of Hsinchu (TW)

Yu-Hsiang Hu of Hsinchu (TW)

Hung-Jui Kuo of Hsinchu (TW)

SEMICONDUCTOR DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240186257 titled 'SEMICONDUCTOR DEVICE

Simplified Explanation

The semiconductor device described in the patent application includes a first semiconductor module, a redistribution layer (RDL) module, and a second semiconductor module. The RDL module is made up of polymer layers and vias, stacked on the first semiconductor module, with specific height differences and angles. The second semiconductor module is placed on top of the RDL module.

• The semiconductor device comprises a first semiconductor module, an RDL module, and a second semiconductor module.
• The RDL module consists of polymer layers and vias, with specific height differences and angles.
• The second semiconductor module is positioned on top of the RDL module.

1. 1. 1. Potential Applications

This technology could be applied in the manufacturing of advanced semiconductor devices for various electronic applications.

1. 1. 1. Problems Solved

This innovation solves the challenge of integrating multiple semiconductor modules with precise height differences and angles, enhancing the overall performance and reliability of the device.

1. 1. 1. Benefits

The benefits of this technology include improved functionality, increased efficiency, and enhanced durability of semiconductor devices.

1. 1. 1. Potential Commercial Applications

This technology has potential applications in the semiconductor industry for developing high-performance electronic devices.

1. 1. 1. Possible Prior Art

Prior art may include similar patents or research related to semiconductor device integration and packaging techniques.

1. 1. 1. 1. What are the specific materials used in the polymer layers and vias of the RDL module?

The patent application does not provide detailed information on the specific materials used in the polymer layers and vias of the RDL module.

1. 1. 1. 1. How does the height difference of the polymer layers impact the overall performance of the semiconductor device?

The patent application does not elaborate on how the height difference of the polymer layers affects the performance of the semiconductor device.

1. 1. 1. Frequently Updated Research

There may be ongoing research in the semiconductor industry related to advanced packaging techniques and materials used in semiconductor devices.

Original Abstract Submitted

according to one embodiment, a semiconductor device is provided. the semiconductor device includes a first semiconductor module, a redistribution layer (rdl) module and a second semiconductor module. the rdl module is disposed on the first semiconductor module. the rdl module includes a plurality of polymer layers and a plurality of vias. the polymer layers are stacked on the first semiconductor module. the vias are disposed within the polymer layers. the second semiconductor module is disposed on the rdl module. a height difference of a top surface of at least one of the polymer layers ranges from 0 um to 1 um; or an angle between a sidewall and a bottom surface of at least one of the vias ranges from 90� to 95�; or a glass transition temperature (tg) of at least one of the polymer layers is larger than 260� c.