Taiwan semiconductor manufacturing co., ltd. (20240186252). METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES simplified abstract
Contents
METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES
Organization Name
taiwan semiconductor manufacturing co., ltd.
Inventor(s)
Yu-Hung Lin of Taichung City (TW)
An-Jhih Su of Taoyuan City (TW)
Der-Chyang Yeh of Hsin-Chu (TW)
Shih-Guo Shen of New Taipei City (TW)
Ming-Shih Yeh of Hsinchu County (TW)
METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240186252 titled 'METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES
Simplified Explanation
The method of manufacturing a semiconductor device described in the abstract involves the following steps:
- A semiconductor substrate is provided.
- A plurality of dielectric layers and a plurality of first conductive features in the dielectric layers are formed on the semiconductor substrate.
- At least one polymer layer and a plurality of second conductive features in the at least one polymer layer on the dielectric layers are formed.
- A plurality of conductive connectors are formed to electrically connect to the second conductive features.
- The semiconductor substrate, the dielectric layers, and the at least one polymer layer are cut into a plurality of dies.
- Potential Applications
This technology can be applied in the manufacturing of various semiconductor devices such as integrated circuits, microprocessors, and memory chips.
- Problems Solved
This technology solves the problem of efficiently manufacturing semiconductor devices with multiple layers and features while ensuring proper electrical connectivity.
- Benefits
The benefits of this technology include improved performance, increased functionality, and enhanced reliability of semiconductor devices.
- Potential Commercial Applications
The potential commercial applications of this technology include the semiconductor industry, electronics manufacturing, and technology companies.
- Possible Prior Art
One possible prior art for this technology could be the method of manufacturing semiconductor devices with similar layering and connectivity features.
- What are the specific materials used in the manufacturing process described in the patent application?
The specific materials used in the manufacturing process include a semiconductor substrate, dielectric layers, polymer layers, and conductive connectors.
- How does the cutting process of the semiconductor substrate, dielectric layers, and polymer layer into dies affect the overall efficiency of the manufacturing process?
The cutting process into dies allows for the individual packaging of each semiconductor device, which can improve yield rates and reduce waste in the manufacturing process.
- Frequently Updated Research
I am not aware of any frequently updated research on this specific technology.
Original Abstract Submitted
a method of manufacturing a semiconductor device includes the following steps. a semiconductor substrate is provided. a plurality of dielectric layers and a plurality of first conductive features in the dielectric layers are formed on the semiconductor substrate. at least one polymer layer and a plurality of second conductive features in the at least one polymer layer on the dielectric layers are formed. a plurality of conductive connectors are formed to electrically connect to the second conductive features. the semiconductor substrate, the dielectric layers and the at least one polymer layer are cut into a plurality of dies.
