Taiwan semiconductor manufacturing co., ltd. (20240186235). INTEGRATED CHIP INCLUDING A CAPACITOR ARRAY simplified abstract
Contents
- 1 INTEGRATED CHIP INCLUDING A CAPACITOR ARRAY
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 INTEGRATED CHIP INCLUDING A CAPACITOR ARRAY - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 What are the potential challenges in implementing this technology in real-world applications?
- 1.11 How does this technology compare to similar innovations in the semiconductor industry?
- 1.12 Original Abstract Submitted
INTEGRATED CHIP INCLUDING A CAPACITOR ARRAY
Organization Name
taiwan semiconductor manufacturing co., ltd.
Inventor(s)
Shu-Cheng Chin of Hsinchu (TW)
Kong-Beng Thei of Pao-Shan Village (TW)
Jung-Hui Kao of Hsin-Chen (TW)
Wen-Ting Hsiao of Miaoli County (TW)
Kuei-Kai Hou of New Taipei City (TW)
INTEGRATED CHIP INCLUDING A CAPACITOR ARRAY - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240186235 titled 'INTEGRATED CHIP INCLUDING A CAPACITOR ARRAY
Simplified Explanation
The integrated chip described in the patent application includes a substrate with a transistor device, conductive interconnects, under-bump metal (UBM) layers, metal bumps, and a metal-insulator-metal (MIM) capacitor array. The MIM capacitor array consists of multiple capacitors arranged in parallel under the first UBM layer.
- The integrated chip comprises a substrate with a transistor device and conductive interconnects.
- A metal-insulator-metal (MIM) capacitor array is positioned over the transistor device and under the first under-bump metal (UBM) layer.
- The MIM capacitor array includes a first MIM capacitor and a second MIM capacitor connected in parallel.
- The first metal bump is directly over the first UBM layer.
Potential Applications
The technology described in this patent application could be applied in the semiconductor industry for the development of advanced integrated circuits with improved capacitor arrays.
Problems Solved
This innovation addresses the need for enhanced capacitor arrays in integrated chips, providing better performance and functionality in electronic devices.
Benefits
The integrated chip with the MIM capacitor array offers increased capacitance and efficiency, leading to improved overall performance of electronic devices.
Potential Commercial Applications
The technology could be utilized in the production of high-performance electronic devices such as smartphones, tablets, and computers.
Possible Prior Art
Prior art related to integrated circuits with capacitor arrays may exist in the semiconductor industry, but specific examples are not provided in this patent application.
What are the potential challenges in implementing this technology in real-world applications?
One potential challenge could be the integration of the MIM capacitor array into existing semiconductor manufacturing processes. Another challenge might be optimizing the performance of the capacitor array for different electronic devices and applications.
How does this technology compare to similar innovations in the semiconductor industry?
This technology appears to offer an improved capacitor array design for integrated circuits, potentially providing better performance and efficiency compared to existing solutions.
Original Abstract Submitted
an integrated chip including a substrate and a transistor device along the substrate. a plurality of conductive interconnects are over the transistor device. a first under-bump metal (ubm) layer is over the conductive interconnects. a first metal bump is directly over the first ubm layer. a metal-insulator-metal (mim) capacitor array is over the transistor device and under the first ubm layer. the mim capacitor array includes a first mim capacitor and a second mim capacitor coupled in parallel and disposed directly under the first ubm layer.
