Taiwan semiconductor manufacturing co., ltd. (20240181598). MONOLITHIC PLATEN simplified abstract

MONOLITHIC PLATEN

Organization Name

taiwan semiconductor manufacturing co., ltd.

Inventor(s)

Tsung-Lung Lai of Hsinchu City (TW)

Cheng-Ping Chen of Taichung City (TW)

Shih-Chung Chen of Hsinchu City (TW)

Sheng-Tai Peng of Hsinchu City (TW)

MONOLITHIC PLATEN - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240181598 titled 'MONOLITHIC PLATEN

Simplified Explanation

The abstract of the patent application describes a chemical mechanical planarization (CMP) system with a monolithic platen and a polishing fluid delivery module.

• Monolithic platen:

   * Formed of a single piece of material.
   * Includes a first portion within a first opening and a second portion within a second opening.
   * The first portion has a different diameter than the second portion.

• Polishing fluid delivery module:

   * Positioned above the monolithic platen.
   * Configured to deliver slurry to the monolithic platen during CMP.

Potential Applications

The technology described in the patent application could be applied in semiconductor manufacturing processes that require precise and uniform polishing of surfaces, such as integrated circuits and memory devices.

Problems Solved

1. Inconsistent polishing results due to variations in platen structure. 2. Inefficient slurry delivery during CMP processes.

Benefits

1. Improved polishing uniformity and accuracy. 2. Enhanced efficiency in slurry delivery. 3. Reduced maintenance and replacement costs.

Potential Commercial Applications

Optimizing CMP processes in semiconductor fabrication facilities for increased productivity and quality control.

Possible Prior Art

There may be prior art related to CMP systems with monolithic platens, but specific examples are not provided in the patent application.

What are some questions that are not answered by this article?

How does the monolithic platen material impact the CMP process?

The material composition of the monolithic platen could affect its durability, heat resistance, and compatibility with different polishing slurries.

Are there any specific industries or sectors that would benefit most from this technology?

Identifying the primary markets or applications where the CMP system with a monolithic platen would have the greatest impact could help target commercialization efforts effectively.

Original Abstract Submitted

in an embodiment, a chemical mechanical planarization (cmp) system includes: a monolithic platen within a platen housing, wherein the monolithic platen is formed of a single piece of material, wherein the monolithic platen includes: a first portion within a first opening, and a second portion within a second opening, wherein the first portion has a different diameter than the second portion; and a polishing fluid delivery module above the monolithic platen, wherein the polishing fluid delivery module is configured to deliver slurry to the monolithic platen during performance of cmp.