Taiwan semiconductor manufacturing co., ltd. (20240162290). INTEGRATED CHIP AND METHOD OF FORMING THEREOF simplified abstract
Contents
- 1 INTEGRATED CHIP AND METHOD OF FORMING THEREOF
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 INTEGRATED CHIP AND METHOD OF FORMING THEREOF - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
INTEGRATED CHIP AND METHOD OF FORMING THEREOF
Organization Name
taiwan semiconductor manufacturing co., ltd.
Inventor(s)
Yong-Shiuan Tsair of Tainan City (TW)
INTEGRATED CHIP AND METHOD OF FORMING THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240162290 titled 'INTEGRATED CHIP AND METHOD OF FORMING THEREOF
Simplified Explanation
The integrated chip described in the abstract comprises a substrate, an isolation structure, and a gate structure. The isolation structure encloses an active region in the substrate, which includes a source region and a drain region separated by a channel region. The gate structure is positioned over the channel region and consists of two gate electrode regions with different compositions.
- The integrated chip includes a substrate, isolation structure, and gate structure.
- The isolation structure encloses an active region with source and drain regions separated by a channel region.
- The gate structure has two gate electrode regions with different compositions.
Potential Applications
The technology described in this patent application could be applied in the following areas:
- Semiconductor manufacturing
- Integrated circuit design
- Electronics industry
Problems Solved
This technology addresses the following issues:
- Enhancing performance of integrated chips
- Improving efficiency of semiconductor devices
- Increasing reliability of electronic components
Benefits
The integrated chip with the described structure offers the following benefits:
- Higher speed and performance
- Better control over electronic signals
- Enhanced durability and longevity
Potential Commercial Applications
The technology could be utilized in various commercial applications, such as:
- Mobile devices
- Computer hardware
- Automotive electronics
Possible Prior Art
One possible prior art for this technology could be the development of advanced semiconductor materials and structures in the field of integrated circuits.
What are the potential environmental impacts of this technology?
The potential environmental impacts of this technology could include electronic waste generation and energy consumption during manufacturing processes. Companies utilizing this technology should consider implementing sustainable practices to mitigate these impacts.
How does this technology compare to existing solutions on the market?
This technology offers improved performance and efficiency compared to existing solutions on the market. By incorporating different compositions in the gate electrode regions, the integrated chip can achieve better control over electronic signals and enhance overall functionality.
Original Abstract Submitted
an integrated chip comprises a substrate, an isolation structure and a gate structure. the isolation structure is disposed in the substrate and enclosing an active region in the substrate. the active region comprises a source region and a drain region separated by a channel region along a first direction. the gate structure is disposed over the channel region and comprising a first gate electrode region and a second gate electrode region arranged one next to another laterally along a second direction perpendicular to the first direction. the first gate electrode region has a first composition, and the second gate electrode region has a second composition different than the first composition.
