Taiwan semiconductor manufacturing co., ltd. (20240162172). SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION simplified abstract
Contents
- 1 SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION
Organization Name
taiwan semiconductor manufacturing co., ltd.
Inventor(s)
Wen-Shiang Liao of Toufen Township (TW)
SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240162172 titled 'SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION
Simplified Explanation
The abstract describes a semiconductor die package that utilizes a dielectric waveguide for communication between semiconductor dies. The waveguide consists of a high dielectric constant core layer surrounded by low dielectric constant cladding layers, allowing for loose coupling of electromagnetic signal modes and total internal reflections in the core layer.
- The semiconductor die package includes a dielectric waveguide with a high dielectric constant core layer and low dielectric constant cladding layers.
- The high dielectric constant core layer enables loose coupling of electromagnetic signal modes.
- The low dielectric constant cladding layers sandwich the core layer, providing a relatively low critical angle for total internal reflections.
- This technology enables increased inter-die communication bandwidth, reduced footprint, and increased density for semiconductor die packages.
Potential Applications
This technology could be applied in high-speed data communication systems, integrated circuits, and advanced semiconductor devices.
Problems Solved
This innovation addresses the need for increased communication bandwidth between semiconductor dies while maintaining a compact footprint and high density.
Benefits
The benefits of this technology include improved inter-die communication, enhanced performance in semiconductor devices, and increased efficiency in data transmission.
Potential Commercial Applications
Potential commercial applications of this technology include data centers, telecommunications equipment, and consumer electronics.
Possible Prior Art
Prior art may include similar dielectric waveguide technologies used in optical communication systems or high-frequency applications.
Unanswered Questions
How does this technology compare to traditional inter-die communication methods in terms of speed and efficiency?
This article does not provide a direct comparison between this technology and traditional inter-die communication methods.
What are the potential challenges or limitations of implementing this technology in practical semiconductor devices?
The article does not address any potential challenges or limitations that may arise when implementing this technology in real-world semiconductor devices.
Original Abstract Submitted
semiconductor dies in a semiconductor die package may communicate through a dielectric waveguide. the dielectric waveguide may include a high dielectric constant (high-k) core layer that is sandwiched by low dielectric constant (low-k) cladding layers. the difference in dielectric constants of the high-k core layer and the low-k cladding layers enables loose coupling of electromagnetic signal modes in the dielectric waveguide while providing a relatively low critical angle for achieving total internal reflections in the high-k core layer. thus, the combination of semiconductor die package techniques described herein and the dielectric waveguide described herein may enable increased inter-die communication bandwidth while achieving a reduced footprint and increased density for semiconductor die packages.
