Taiwan semiconductor manufacturing co., ltd. (20240162109). Package with Improved Heat Dissipation Efficiency and Method for Forming the Same simplified abstract

Package with Improved Heat Dissipation Efficiency and Method for Forming the Same

Organization Name

taiwan semiconductor manufacturing co., ltd.

Inventor(s)

Hung-Yi Kuo of Taipei City (TW)

Chen-Hua Yu of Hsinchu (TW)

Kuo-Chung Yee of Taoyuan City (TW)

Yu-Jen Lien of Tainan City (TW)

Ke-Han Shen of Chiayi City (TW)

Wei-Kong Sheng of Chu-Nan (TW)

Chung-Shi Liu of Hsinchu (TW)

Szu-Wei Lu of Hsinchu (TW)

Tsung-Fu Tsai of Changhua City (TW)

Chung-Ju Lee of Hsinchu (TW)

Chih-Ming Ke of Hsinchu (TW)

Package with Improved Heat Dissipation Efficiency and Method for Forming the Same - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240162109 titled 'Package with Improved Heat Dissipation Efficiency and Method for Forming the Same

Simplified Explanation

The patent application describes a package for an integrated circuit device with a heat dissipation structure, including a spreading layer with islands, pillars, and nanostructures.

• The package includes an integrated circuit device attached to a substrate, with an encapsulant covering the device and a heat dissipation structure on top.
• The heat dissipation structure consists of a spreading layer with islands arranged in lines, pillars on top of the islands, and nanostructures on the pillars.

Potential Applications

The technology described in the patent application could be used in various electronic devices where heat dissipation is crucial, such as high-performance computers, servers, and mobile devices.

Problems Solved

This technology addresses the issue of heat buildup in integrated circuit devices, which can affect performance and reliability. By providing an efficient heat dissipation structure, the package can help maintain optimal operating temperatures for the device.

Benefits

The package design with the heat dissipation structure can improve the overall performance and longevity of integrated circuit devices by effectively managing heat dissipation. This can lead to better reliability and stability of electronic devices.

Potential Commercial Applications

The technology could be valuable for semiconductor manufacturers looking to enhance the thermal management of their products. It could also be attractive to companies producing high-performance electronic devices that require efficient heat dissipation solutions.

Possible Prior Art

One possible prior art could be the use of heat sinks or thermal pads for heat dissipation in electronic devices. However, the specific design of the spreading layer with islands, pillars, and nanostructures as described in the patent application may be a novel approach to improving heat dissipation.

How does the arrangement of the islands in lines contribute to heat dissipation efficiency?

The patent application mentions that at least a portion of the islands are arranged as lines extending in a first direction. It would be interesting to know how this specific arrangement helps in enhancing heat dissipation compared to other configurations.

What are the potential challenges in manufacturing the heat dissipation structure with nanostructures?

While nanostructures can offer significant benefits in heat dissipation, their integration into the package design may pose manufacturing challenges. Understanding the obstacles and potential solutions for incorporating nanostructures could provide valuable insights into the feasibility of the technology.

Original Abstract Submitted

in an embodiment, a package includes an integrated circuit device attached to a substrate; an encapsulant disposed over the substrate and laterally around the integrated circuit device, wherein a top surface of the encapsulant is coplanar with the top surface of the integrated circuit device; and a heat dissipation structure disposed over the integrated circuit device and the encapsulant, wherein the heat dissipation structure includes a spreading layer disposed over the encapsulant and the integrated circuit device, wherein the spreading layer includes a plurality of islands, wherein at least a portion of the islands are arranged as lines extending in a first direction in a plan view; a plurality of pillars disposed over the islands of the spreading layer; and nanostructures disposed over the pillars.