Taiwan semiconductor manufacturing co., ltd. (20240162064). MULTI-FLIP SEMICONDUCTOR DIE SORTER TOOL simplified abstract
Contents
- 1 MULTI-FLIP SEMICONDUCTOR DIE SORTER TOOL
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 MULTI-FLIP SEMICONDUCTOR DIE SORTER TOOL - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
MULTI-FLIP SEMICONDUCTOR DIE SORTER TOOL
Organization Name
taiwan semiconductor manufacturing co., ltd.
Inventor(s)
Chih-Hung Huang of Hsinchu (TW)
Cheng-Lung Wu of Zhunan Township (TW)
Zheng-Lin He of Hsinchu City (TW)
Yang-Ann Chu of Hsinchu City (TW)
Jiun-Rong Pai of Jhubei City (TW)
MULTI-FLIP SEMICONDUCTOR DIE SORTER TOOL - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240162064 titled 'MULTI-FLIP SEMICONDUCTOR DIE SORTER TOOL
Simplified Explanation
The patent application describes a die sorter tool that includes conveyors, lanes, and a die flip module to manipulate dies within a carrier without changing their positions.
- First conveyor to receive carriers with dies from load ports
- Die flip module to manipulate orientations of dies within the carrier
- Second conveyor to return carrier to load ports after manipulation
Potential Applications
The die sorter tool can be used in semiconductor manufacturing facilities to efficiently sort and manipulate dies for further processing.
Problems Solved
1. Streamlining the die sorting process by manipulating dies without changing their positions within the carrier. 2. Increasing efficiency and accuracy in die handling and processing.
Benefits
1. Improved productivity and throughput in semiconductor manufacturing. 2. Reduced risk of damage to dies during handling and sorting processes.
Potential Commercial Applications
Optimizing die sorting and manipulation processes in semiconductor manufacturing facilities for increased efficiency and productivity.
Possible Prior Art
Prior art related to die sorting and manipulation tools in semiconductor manufacturing processes may exist, but specific examples are not provided in the patent application.
Unanswered Questions
How does the die flip module ensure the accurate manipulation of dies within the carrier?
The patent application does not detail the specific mechanisms or technologies used in the die flip module to ensure precise manipulation of dies. Further information on the operational principles of this module would be beneficial for a deeper understanding of the technology.
What are the potential limitations or challenges in implementing this die sorter tool in semiconductor manufacturing facilities?
While the benefits and applications of the die sorter tool are highlighted, the patent application does not address any potential limitations or challenges that may arise during the implementation of this technology. Understanding the possible obstacles in integrating this tool into existing manufacturing processes would provide a more comprehensive view of its practicality and feasibility.
Original Abstract Submitted
a die sorter tool may include a first conveyor, and a first lane to receive, from one or more load ports and via the first conveyor, a carrier with a set of dies. the die sorter tool may include a die flip module to receive the carrier from the first lane, manipulate one or more dies of the set of dies by changing orientations of the one or more dies, and return the one or more dies to the carrier after manipulating the one or more dies and without changing positions of the one or more dies within the carrier. the die sorter tool may include a second conveyor, and a second lane to receive, via the second conveyor, the carrier from the die flip module, and provide, via the first conveyor, the carrier to the one or more load ports.
