TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC. (20240230248). 3D PRINTED COLD PLATES AND METHODS FOR COOLING POWER DEVICES EMBEDDED IN 3D PRINTED CIRCUIT BOARDS simplified abstract

3D PRINTED COLD PLATES AND METHODS FOR COOLING POWER DEVICES EMBEDDED IN 3D PRINTED CIRCUIT BOARDS

Organization Name

TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.

Inventor(s)

Feng Zhou of Ann Arbor MI (US)

Ercan Dede of Ann Arbor MI (US)

3D PRINTED COLD PLATES AND METHODS FOR COOLING POWER DEVICES EMBEDDED IN 3D PRINTED CIRCUIT BOARDS - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240230248 titled '3D PRINTED COLD PLATES AND METHODS FOR COOLING POWER DEVICES EMBEDDED IN 3D PRINTED CIRCUIT BOARDS

Simplified Explanation: The patent application describes a method involving the use of a 3D printer to print a cold plate with an embedded electrical insulation layer on the top surface, as well as a conductor substrate embedded within the insulation layer.

• The method involves printing a cold plate using a 3D printer.
• An electrical insulation layer is embedded in the top surface of the cold plate.
• A conductor substrate is printed within the electrical insulation layer on the top surface of the cold plate.

Key Features and Innovation:

• Integration of an electrical insulation layer within a cold plate.
• Embedding a conductor substrate within the insulation layer.
• Utilization of 3D printing technology for manufacturing.

Potential Applications:

• Thermal management systems in electronic devices.
• Heat dissipation in power electronics.
• Cooling solutions for high-performance computing.

Problems Solved:

• Enhanced thermal conductivity.
• Improved electrical insulation.
• Efficient heat dissipation.

Benefits:

• Increased performance and reliability of electronic devices.
• Cost-effective manufacturing process.
• Customizable designs for specific applications.

Commercial Applications:

• Electronic device manufacturing industry.
• Automotive industry for electric vehicles.
• Aerospace industry for avionics systems.

Questions about the Technology: 1. How does the integration of the electrical insulation layer within the cold plate improve thermal management? 2. What are the advantages of embedding a conductor substrate within the insulation layer for electronic devices?

Original Abstract Submitted

a method includes printing, using a 3d printer, a cold plate, printing, using a 3d printer, an electrical insulation layer embedded in a top surface of the cold plate, and printing, using a 3d printer, a conductor substrate embedded in the electrical insulation layer embedded in the top surface of the cold plate.