TONG HSING ELECTRONIC INDUSTRIES, LTD. Patent Application Trends in 2024
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Contents
- 1 TONG HSING ELECTRONIC INDUSTRIES, LTD. Patent Filing Activity
- 2 TONG HSING ELECTRONIC INDUSTRIES, LTD. patent applications in 2024
- 3 Top 10 Technology Areas
- 4 Emerging Technology Areas
- 5 Top Inventors
- 6 Patent Categories
- 7 Geographical Distribution of Inventors
- 8 Geographical Distribution of US Inventors
TONG HSING ELECTRONIC INDUSTRIES, LTD. Patent Filing Activity
TONG HSING ELECTRONIC INDUSTRIES, LTD. patent applications in 2024
Top 10 Technology Areas
- H01L27/14618 ({Containers})
- H01L24/48 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L2224/48227 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L24/32 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L27/14636 ({Interconnect structures})
- Count: 5 patents
- Example: 20240234457. CHIP PACKAGE STRUCTURE simplified abstract (TONG HSING ELECTRONIC INDUSTRIES, LTD.)
- H01L24/73 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L27/14623 ({Optical shielding})
- Count: 4 patents
- Example: 20240234457. CHIP PACKAGE STRUCTURE simplified abstract (TONG HSING ELECTRONIC INDUSTRIES, LTD.)
- H01L24/29 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- Count: 4 patents
- Example: 20240128139. SENSOR PACKAGE STRUCTURE simplified abstract (TONG HSING ELECTRONIC INDUSTRIES, LTD.)
- H01L2224/32225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L21/50 (Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups)
Emerging Technology Areas
- H01L2224/29035 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- Count: 1 patents
- Example: 20240047491. SENSOR PACKAGE STRUCTURE simplified abstract (TONG HSING ELECTRONIC INDUSTRIES, LTD.)
- H05K2201/09545 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS)
- H05K2203/1377 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS)
- H05K2203/107 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS)
- H05K2203/0723 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS)
- H05K1/0353 (Use of materials for the substrate)
- H05K3/423 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS)
- H05K3/06 (the conductive material being removed chemically or electrolytically, e.g. by photo-etch process {(semi-additive methods)
- H01L2224/16227 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
- H01L25/13 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
Top Inventors
- LI-CHUN HUNG (11 patents)
- CHIEN-CHEN LEE (9 patents)
- JUI-HUNG HSU (6 patents)
- WEI-LI WANG (5 patents)
- WEN-FU YU (5 patents)
- BAE-YINN HWANG (5 patents)
- CHIEN-HUNG LIN (5 patents)
- CHIA-SHUAI CHANG (3 patents)
- DONG-RU WU (2 patents)
- Li-Chun Hung (2 patents)
Patent Categories
Geographical Distribution of Inventors
Geographical Distribution of US Inventors
TONG HSING ELECTRONIC INDUSTRIES, LTD. Inventor States 2024 - Up to June 2024
Categories:
- Pages with broken file links
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- Companies
- CPC H01L21/52
- CPC H01L23/041
- CPC H01L24/32
- CPC H01L24/48
- CPC H01L24/73
- CPC H01L24/92
- CPC H01L27/14618
- CPC H01L2224/32225
- CPC H01L2224/48227
- CPC H01L2224/73265
- CPC H01L2224/92247
- CPC H01L21/50
- CPC H01L27/14623
- CPC H01L27/14636
- CPC H01L27/14683
- CPC H01L24/85
- CPC H01L2224/85801
- CPC H01L23/3114
- CPC H01L23/3121
- CPC H01L23/3142
- CPC H01L24/29
- CPC H01L25/0655
- CPC H01L21/3043
- CPC H01L24/13
- CPC H01L24/81
- CPC H01L24/83
- CPC H01L2224/29017
- CPC H01L2224/73215
- CPC H05K1/113
- CPC H01L2224/48228
- CPC H01L2224/48453
- CPC H01L2224/48464
- CPC H01L2924/37001
- CPC H01L2924/386
- CPC H05K2201/032
- CPC H05K2201/09745
- CPC H01L24/97
- CPC H01L23/544
- CPC H01L23/49827
- CPC H01L2223/54486
- CPC H01L2224/95148
- CPC H01L2223/54426
- CPC H01L2224/97
- CPC H01L33/44
- CPC H01L27/14625
- CPC H01L27/14685
- CPC H01L31/02327
- CPC H01L2933/0058
- CPC H01L21/481
- CPC H01L21/486
- CPC H01L33/486
- CPC H01L33/60
- CPC H01L33/62
- CPC H01L2933/0066
- CPC H01L23/5384
- CPC H01L23/5386
- CPC H01L23/552
- CPC H01L24/16
- CPC H01L25/13
- CPC H01L2224/16227
- CPC H05K3/06
- CPC H05K3/423
- CPC H05K1/0353
- CPC H05K2203/0723
- CPC H05K2203/107
- CPC H05K2203/1377
- CPC H05K2201/09545
- CPC H01L2224/29035
- Patent Trends by Company in 2024
