TE Connectivity Solutions GmbH patent applications published on September 19th, 2024
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Contents
- 1 Patent applications for TE Connectivity Solutions GmbH on September 19th, 2024
- 1.1 OPTICAL BACKPLANE CONNECTOR SYSTEM (18605120)
- 1.2 Semiconductor Die and Method for Attaching a Semiconductor Die to a Solid Structure with Controlled Fillet Height (18604807)
- 1.3 Electrical Contact with Textured Contact Interface (18589488)
- 1.4 DAUGHTER-CARD OPTICAL BACKPLANE CONNECTOR SYSTEM (18605145)
- 1.5 CONTACT CARRIER, METHOD OF PRODUCING A CONTACT CARRIER AND APPARATUS FOR PRODUCING A CONTACT CARRIER (18604407)
- 1.6 Ground Shield Contact Member (18589478)
- 1.7 Stripline Wafer for Wafer Based Connector System (18589470)
Patent applications for TE Connectivity Solutions GmbH on September 19th, 2024
OPTICAL BACKPLANE CONNECTOR SYSTEM (18605120)
Main Inventor
Mark Benton
Semiconductor Die and Method for Attaching a Semiconductor Die to a Solid Structure with Controlled Fillet Height (18604807)
Main Inventor
Kaspar Jenni
Electrical Contact with Textured Contact Interface (18589488)
Main Inventor
Charles Raymond GINGRICH, III
DAUGHTER-CARD OPTICAL BACKPLANE CONNECTOR SYSTEM (18605145)
Main Inventor
Mark Benton
CONTACT CARRIER, METHOD OF PRODUCING A CONTACT CARRIER AND APPARATUS FOR PRODUCING A CONTACT CARRIER (18604407)
Main Inventor
Peter DEVOS
Ground Shield Contact Member (18589478)
Main Inventor
Jacobus Nicolaas TUIN
Stripline Wafer for Wafer Based Connector System (18589470)
Main Inventor
Bruce Allen CHAMPION
