Sumitomo electric industries, ltd. (20250105157). BRIDGE CHIP AND SEMICONDUCTOR INTEGRATED MODULE
BRIDGE CHIP AND SEMICONDUCTOR INTEGRATED MODULE
Organization Name
sumitomo electric industries, ltd.
Inventor(s)
BRIDGE CHIP AND SEMICONDUCTOR INTEGRATED MODULE
This abstract first appeared for US patent application 20250105157 titled 'BRIDGE CHIP AND SEMICONDUCTOR INTEGRATED MODULE
Original Abstract Submitted
a bridge chip according to one embodiment includes a substrate having a first surface and a second surface opposite to the first surface; a first resin film having flexibility, and formed on the first surface of the substrate; and a metal film formed on the first resin film. the metal film includes a connecting portion for an electrical connection with an element. the substrate includes a buffer portion penetrating through the substrate between the first surface and the second surface. the connecting portion is disposed inside the buffer portion in a plan view of the substrate.