New pages
Jump to navigation
Jump to search
(newest | oldest) View (newer 20 | older 20) (20 | 50 | 100 | 250 | 500)
- 18:01, 22 March 2025 Intel corporation (20250097249). METHODS AND APPARATUS FOR ARTIFICIAL INTELLIGENCE (AI) MODEL SECURITY PROTECTION USING MOVING TARGET DEFENSES (hist) [1,815 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 18:01, 22 March 2025 Intel corporation (20250097120). TECHNIQUES FOR ARTIFICIAL INTELLIGENCE CAPABILITIES AT A NETWORK SWITCH (hist) [1,692 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 18:00, 22 March 2025 Intel corporation (20250097081). COMPLEX-ZERO EQUALIZER CIRCUIT (hist) [1,566 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 18:00, 22 March 2025 Intel corporation (20250096975). ENHANCED DEMODULATION REFERENCE SIGNAL (DMRS) FOR UPLINK TRANSMISSION (hist) [1,590 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 18:00, 22 March 2025 Intel corporation (20250096809). DELAY-LOCKED LOOP (DLL) WITH BINARY SEARCH LOCKING AND DEAD CLOCK DETECTION (hist) [1,464 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 18:00, 22 March 2025 Intel corporation (20250096787). MULTI-LEVEL DRIVING FOR EFFICIENT SWITCHING REGULATORS (hist) [1,413 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 18:00, 22 March 2025 Intel corporation (20250096200). 3D STACKED VOLTAGE REGULATOR WITH COMPONENTS DISTRIBUTED ON MULTIPLE WAFERS OR DICE (hist) [1,673 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 18:00, 22 March 2025 Intel corporation (20250096197). SCALABLE EMBEDDED SILICON BRIDGE VIA PILLARS IN LITHOGRAPHICALLY DEFINED VIAS, AND METHODS OF MAKING SAME (hist) [1,491 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 18:00, 22 March 2025 Intel corporation (20250096194). MICROELECTRONIC ASSEMBLIES (hist) [1,541 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 18:00, 22 March 2025 Intel corporation (20250096178). MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIAL (SA-TIM) (hist) [1,662 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 18:00, 22 March 2025 Intel corporation (20250096154). Package Substrates with Stiffener Interposers (hist) [1,385 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 18:00, 22 March 2025 Intel corporation (20250096143). MICROELECTRONIC ASSEMBLY WITH BRIDGE DIE AND SELECTIVE METALLIZATION LAYERS (hist) [1,802 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 18:00, 22 March 2025 Intel corporation (20250096114). VIA STRUCTURE WITH IMPROVED SUBSTRATE GROUNDING (hist) [2,613 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 18:00, 22 March 2025 Intel corporation (20250096053). MICROELECTRONIC ASSEMBLIES HAVING A BRIDGE DIE OVER A GLASS PATCH (hist) [2,150 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 17:59, 22 March 2025 Intel corporation (20250096052). LOCALIZED THERMAL HEALING AND DOPING OF GLASS CORES FOR MICROELECTRONIC ASSEMBLIES (hist) [2,581 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 17:59, 22 March 2025 Intel corporation (20250096009). LOW COST PACKAGE WARPAGE SOLUTION (hist) [1,856 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 17:59, 22 March 2025 Intel corporation (20250095693). CONNECTIONS OF BIT LINES AND WORD LINES IN STACKED MEMORY LAYERS TO A COMPLEMENTARY METAL-OXIDE-SEMICONDUCTOR LAYER (hist) [2,438 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 17:59, 22 March 2025 Intel corporation (20250095522). IMAGING FOR FOLDABLE DISPLAYS (hist) [1,100 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 17:59, 22 March 2025 Intel corporation (20250095217). LOW RANK MATRIX COMPRESSION (hist) [2,268 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 17:59, 22 March 2025 Intel corporation (20250095122). DISTORTION MESHES AGAINST CHROMATIC ABERRATIONS (hist) [1,413 bytes] Wikipatents (talk | contribs) (Creating a new page)
