Pages that link to "Category:Jooi Wah Wong of Bukit Mertajam (MY)"
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The following pages link to Category:Jooi Wah Wong of Bukit Mertajam (MY):
View (previous 50 | next 50) (20 | 50 | 100 | 250 | 500)- 17849352. COPPER RINGS FOR BGA COUNT REDUCTION IN SMALL FORM FACTOR PACKAGES simplified abstract (Intel Corporation) (← links)
- 17848630. HYPER DENSITY PACKAGE SUBSTRATE AND MEMORY COUPLED TO A MODIFIED SEMI-ADDITIVE PROCESS BOARD simplified abstract (Intel Corporation) (← links)
- 17848643. ELECTRICAL CONDUCTOR EXTENDING FROM A SURFACE OF A SUBSTRATE simplified abstract (Intel Corporation) (← links)
- 17848639. SLOTTED STIFFENER FOR A PACKAGE SUBSTRATE simplified abstract (Intel Corporation) (← links)
- Intel corporation (20240106139). CONNECTOR TO ELECTRICALLY COUPLE MULTIPLE SUBSTRATES simplified abstract (← links)
- Intel corporation (20240136243). COPPER FILL FOR HEAT MANAGEMENT IN INTEGRATED CIRCUIT DEVICE simplified abstract (← links)
- Intel corporation (20240136279). INTEGRATED INDUCTOR OVER TRANSISTOR LAYER simplified abstract (← links)
- 17972923. COPPER FILL FOR HEAT MANAGEMENT IN INTEGRATED CIRCUIT DEVICE simplified abstract (Intel Corporation) (← links)
- 17972975. INTEGRATED INDUCTOR OVER TRANSISTOR LAYER simplified abstract (Intel Corporation) (← links)