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• 18367108. BULK ACOUSTIC WAVE DEVICE PACKAGING WITH REDISTRIBUTION USING BUFFER COAT INSULATION simplified abstract (Skyworks Solutions, Inc.)
  [[Category:H10N30/03]] [[Category:H10N30/063]]
  4 KB (535 words) - 09:18, 25 March 2024
• GM GLOBAL TECHNOLOGY OPERATIONS LLC patent applications on January 23rd, 2025
  ...), [[:Category:CPC_G05D1/2272|G05D1/2272]] (1), [[:Category:CPC_H10N30/202|H10N30/202]] (1), [[:Category:CPC_H02P21/14|H02P21/14]] (1), [[:Category:CPC_H02K5 CPC Code(s): G10L15/063
  48 KB (7,471 words) - 08:55, 19 February 2025
• TEXAS INSTRUMENTS INCORPORATED patent applications on March 6th, 2025
  CPC Code(s): H03K17/063 ...terminal.[[Category:H03K17/06]][[Category:H03K17/10]][[Category:CPC_H03K17/063]][[Category:texas instruments incorporated]]
  61 KB (9,258 words) - 17:29, 9 March 2025
• The Regents of the University of California patent applications on August 1st, 2024
  IPC Code(s): G02B26/08, G02B6/42, H10N30/20, H10N30/853, H10N30/87 ...Category:G02B6/42]][[Category:H10N30/20]][[Category:H10N30/853]][[Category:H10N30/87]][[Category:CPC_G02B26/0875]][[Category:the regents of the university of
  33 KB (5,086 words) - 05:56, 5 August 2024
• Audio Technologies patent applications on June 27th, 2024
  CPC Code(s): G10L15/063 IPC Code(s): H04L65/613, G06F3/16, H04L51/046, H04L51/063
  56 KB (8,186 words) - 01:07, 28 June 2024
• Smart Materials Patent Application Trends 2024
  * [[:Category:CPC_H10N70/063|H10N70/063]] (No explanation available) ** [[:Category:CPC_H10N30/857|H10N30/857]] (No explanation available): 1 patents
  42 KB (4,658 words) - 08:07, 2 January 2025
• Halliburton Energy Services, Inc. Patent Application Trends in 2024
  * [[:Category:CPC_H10N30/302|H10N30/302]] (No explanation available) [[Category:CPC_E21B34/063]]
  23 KB (3,125 words) - 08:46, 19 July 2024
• KABUSHIKI KAISHA TOSHIBA patent applications on March 21st, 2024
  IPC Code(s): C25B13/02, C25B9/19, C25B11/031, C25B11/056, C25B11/063, C25B11/091 ...:C25B9/19]][[Category:C25B11/031]][[Category:C25B11/056]][[Category:C25B11/063]][[Category:C25B11/091]][[Category:kabushiki kaisha toshiba]]
  110 KB (16,569 words) - 07:41, 22 March 2024
• TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. patent applications on September 19th, 2024
  CPC Code(s): G11C5/063 ...11C5/06]][[Category:G11C11/419]][[Category:H10B10/00]][[Category:CPC_G11C5/063]][[Category:taiwan semiconductor manufacturing co., ltd.]]
  156 KB (23,262 words) - 07:01, 19 September 2024
• Audio Technologies patent applications on March 6th, 2025
  CPC Code(s): G10L15/063 IPC Code(s): H04R17/10, H04R3/04, H04R17/02, H04R29/00, H10N30/50, H10N30/87
  67 KB (9,860 words) - 16:30, 9 March 2025
• Audio Technologies patent applications on 7th Mar 2025
  CPC Code(s): G10L15/063 IPC Code(s): H04R17/10, H04R3/04, H04R17/02, H04R29/00, H10N30/50, H10N30/87
  67 KB (9,860 words) - 03:24, 11 March 2025
• Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on March 14th, 2024
  IPC Code(s): G06N3/063, H10B41/30 ...formed in the back end region of the semiconductor device.[[Category:G06N3/063]][[Category:H10B41/30]][[Category:taiwan semiconductor manufacturing compan
  235 KB (34,158 words) - 03:03, 19 March 2024
• Blockchain patent applications on February 29th, 2024
  IPC Code(s): B06B1/06, H10N30/088 [[Category:B06B1/06]][[Category:H10N30/088]][[Category:IONIX ADVANCED TECHNOLOGIES LTD]]
  386 KB (55,261 words) - 03:15, 4 March 2024