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Create the page "H05K1/03" on this wiki! See also the search results found.

• 18625488. PRINTED CIRCUIT BOARD (Samsung Electro-Mechanics Co., Ltd.)
  [[Category:H05K1/16]] [[Category:H05K1/03]]
  1 KB (192 words) - 09:57, 17 March 2025
• Intel corporation (20250105132). POROUS COPPER LINER FOR THROUGH GLASS VIA (TGV) GLASS CORES
  [[Category:H05K1/02]] [[Category:H05K1/03]]
  2 KB (251 words) - 01:41, 30 March 2025
• 18373095. POROUS COPPER LINER FOR THROUGH GLASS VIA (TGV) GLASS CORES (Intel Corporation)
  [[Category:H05K1/02]] [[Category:H05K1/03]]
  2 KB (251 words) - 04:32, 31 March 2025
• Murata manufacturing co., ltd. (20250089160). MULTILAYER SUBSTRATE
  [[Category:H05K1/02]] [[Category:H05K1/03]]
  1 KB (193 words) - 03:40, 15 March 2025
• 18960290. MULTILAYER SUBSTRATE (Murata Manufacturing Co., Ltd.)
  [[Category:H05K1/02]] [[Category:H05K1/03]]
  1 KB (193 words) - 04:19, 15 March 2025
• 18441422. PRINTED CIRCUIT BOARD (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
  [[Category:H05K1/03]] [[Category:H05K1/02]]
  1 KB (224 words) - 07:37, 19 December 2024
• Intel corporation (20250089156). LOW STRESS THROUGH GLASS VIAS (TGVS)
  [[Category:H05K1/02]] [[Category:H05K1/03]]
  2 KB (243 words) - 02:04, 15 March 2025
• 18367963. LOW STRESS THROUGH GLASS VIAS (TGVS) (Intel Corporation)
  [[Category:H05K1/02]] [[Category:H05K1/03]]
  2 KB (243 words) - 04:16, 15 March 2025
• 18751647. PRINTED CIRCUIT BOARD AND METHOD FOR MOUNTING AT LEAST ONE SEMICONDUCTOR CHIP DEVICE (Infineon Technologies AG)
  [[Category:H05K1/03]] [[Category:H05K1/18]]
  2 KB (273 words) - 08:47, 18 February 2025
• Intel corporation (20250106982). NANOTWIN LINER FOR THROUGH GLASS VIAS
  [[Category:H05K1/02]] [[Category:H05K1/03]]
  2 KB (268 words) - 01:43, 30 March 2025
• 18372585. NANOTWIN LINER FOR THROUGH GLASS VIAS (Intel Corporation)
  [[Category:H05K1/02]] [[Category:H05K1/03]]
  2 KB (268 words) - 04:32, 31 March 2025
• Mitsubishi electric corporation (20250016919). MAGNETIC CERAMIC SUBSTRATE, SUBSTRATE MANUFACTURING METHOD, AND CIRCULATOR
  [[Category:H05K1/03]] [[Category:H05K1/02]]
  1 KB (200 words) - 08:04, 18 February 2025
• 18708252. MAGNETIC CERAMIC SUBSTRATE, SUBSTRATE MANUFACTURING METHOD, AND CIRCULATOR (Mitsubishi Electric Corporation)
  [[Category:H05K1/03]] [[Category:H05K1/02]]
  1 KB (200 words) - 08:32, 18 February 2025
• Japan display inc. (20250016920). STRETCHABLE DEVICE
  [[Category:H05K1/03]] [[Category:H05K1/02]]
  1 KB (227 words) - 08:05, 18 February 2025
• 18760610. STRETCHABLE DEVICE (Japan Display Inc.)
  [[Category:H05K1/03]] [[Category:H05K1/02]]
  1 KB (227 words) - 08:33, 18 February 2025
• Intel corporation (20240422899). ENVIRONMENTALLY FRIENDLY MULTI-LAYER PRINTED CIRCUIT BOARD
  [[Category:H05K1/02]] [[Category:H05K1/03]]
  2 KB (221 words) - 06:19, 19 December 2024
• 18335145. ENVIRONMENTALLY FRIENDLY MULTI-LAYER PRINTED CIRCUIT BOARD (Intel Corporation)
  [[Category:H05K1/02]] [[Category:H05K1/03]]
  2 KB (221 words) - 07:18, 19 December 2024
• 18848555. PRINTED WIRING BOARD SUBSTRATE, PRINTED WIRING BOARD, AND MULTILAYER PRINTED WIRING BOARD (SUMITOMO ELECTRIC INDUSTRIES, LTD.)
  [[Category:H05K1/03]] [[Category:H05K1/02]]
  2 KB (328 words) - 10:09, 17 March 2025
• 18278967. ELECTRONIC SUBSTRATE simplified abstract (LG INNOTEK CO., LTD.)
  [[Category:H05K1/02]] [[Category:H05K1/03]]
  3 KB (429 words) - 13:05, 15 July 2024
• 18435032. STRETCHABLE DEVICE simplified abstract (Murata Manufacturing Co., Ltd.)
  [[Category:H05K1/02]] [[Category:H05K1/03]]
  4 KB (502 words) - 03:23, 6 June 2024

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