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Intel corporation (20240413016). TECHNIQUES AND CONFIGURATIONS TO REDUCE TRANSISTOR GATE SHORT DEFECTS
[[Category:H01L27/02]] [[Category:H01L27/088]] ...

2 KB (252 words) - 00:37, 13 December 2024
Semiconductor energy laboratory co., ltd. (20240413166). ANALOG CIRCUIT AND SEMICONDUCTOR DEVICE
[[Category:H01L27/12]] [[Category:H01L27/15]] ...

2 KB (271 words) - 01:06, 13 December 2024
Canon kabushiki kaisha (20250015070). PHOTOELECTRIC CONVERSION APPARATUS, PHOTO-DETECTION SYSTEM, AND MOVABLE BODY
[[Category:G01C3/02]] [[Category:G01K1/02]] ...

2 KB (222 words) - 09:09, 25 March 2025
18886545. PHOTOELECTRIC CONVERSION APPARATUS, PHOTO-DETECTION SYSTEM, AND MOVABLE BODY (CANON KABUSHIKI KAISHA)
[[Category:G01C3/02]] [[Category:G01K1/02]] ...

2 KB (222 words) - 08:18, 18 February 2025
18782379. WIDE BANDGAP SEMICONDUCTOR DEVICE (FUJI ELECTRIC CO., LTD.)
[[Category:H01L27/02]] [[Category:H01L27/088]] ...

1 KB (153 words) - 05:24, 24 March 2025
Texas instruments incorporated (20250006408). THERMISTOR INTEGRATED WITH A BIAS RESISTOR
[[Category:H01C7/02]] [[Category:H01L27/07]] ...

1 KB (160 words) - 04:01, 25 March 2025
Intel corporation (20250022939). CONTACT OVER ACTIVE GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION
[[Category:H01L21/02]] [[Category:H01L27/02]] ...

3 KB (392 words) - 02:31, 26 March 2025
Micron Technology, Inc. patent applications on January 18th, 2024
IPC Code(s): G06F12/02, G06F9/50 [[Category:G06F12/02]][[Category:G06F9/50]][[Category:micron technology, inc.]] ...

14 KB (2,007 words) - 09:01, 30 January 2024
US Patent Application 18361815. SEMICONDUCTOR DEVICE simplified abstract
[[Category:H01L27/088]] [[Category:H01L27/02]] ...

2 KB (299 words) - 15:12, 30 November 2023
Samsung electronics co., ltd. (20240405011). SEMICONDUCTOR INTEGRATED CIRCUIT, SYSTEM ON CHIP AND ELECTRONIC DEVICE TO IMPLEMENT THEM
[[Category:H01L27/02]] [[Category:H01L27/092]] ...

2 KB (244 words) - 15:50, 11 December 2024
Intel corporation (20250098258). PLUGS FOR INTERCONNECT LINES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION
[[Category:H01L21/02]] [[Category:H01L27/02]] ...

3 KB (379 words) - 02:26, 24 March 2025
18970265. PLUGS FOR INTERCONNECT LINES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION (Intel Corporation)
[[Category:H01L21/02]] [[Category:H01L27/02]] ...

3 KB (379 words) - 05:03, 24 March 2025
Semiconductor energy laboratory co., ltd. (20250014615). MEMORY DEVICE AND SEMICONDUCTOR DEVICE
[[Category:H01L27/02]] [[Category:H01L27/06]] ...

2 KB (263 words) - 08:02, 18 February 2025
18768111. MEMORY DEVICE AND SEMICONDUCTOR DEVICE (Semiconductor Energy Laboratory Co., Ltd.)
[[Category:H01L27/02]] [[Category:H01L27/06]] ...

2 KB (263 words) - 08:30, 18 February 2025
Intel corporation (20250006579). MITIGATION OF THRESHOLD VOLTAGE SHIFT IN BACKSIDE POWER DELIVERY USING BACKSIDE PASSIVATION LAYER
[[Category:H01L21/02]] [[Category:H01L27/02]] ...

2 KB (268 words) - 02:40, 25 March 2025
18216476. MITIGATION OF THRESHOLD VOLTAGE SHIFT IN BACKSIDE POWER DELIVERY USING BACKSIDE PASSIVATION LAYER (Intel Corporation)
[[Category:H01L21/02]] [[Category:H01L27/02]] ...

2 KB (268 words) - 10:19, 17 February 2025
Intel corporation (20250072078). HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION
[[Category:H01L21/02]] [[Category:H01L27/02]] ...

3 KB (392 words) - 06:53, 17 March 2025
18940382. HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION (Intel Corporation)
[[Category:H01L21/02]] [[Category:H01L27/02]] ...

3 KB (392 words) - 09:41, 17 March 2025
Samsung electronics co., ltd. (20250022875). THREE-DIMENSIONAL SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
[[Category:H01L27/06]] [[Category:H01L27/02]] ...

2 KB (250 words) - 02:36, 26 March 2025
17460324. MEMORY ARRAY, INTEGRATED CIRCUIT INCLUDING THE SAME, AND MANUFACTURING METHOD THEREOF simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
[[Category:H01L27/105]] [[Category:H01L27/06]] ...

3 KB (413 words) - 05:01, 2 January 2024

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