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• 18546879. HALOGEN-AND ALIPHATIC-CONTAINING ORGANOTIN PHOTORESISTS AND METHODS THEREOF simplified abstract (Lam Research Corporation)
  [[Category:G03F7/004]] [[Category:G03F7/095]]
  4 KB (551 words) - 14:18, 15 July 2024
• 18638436. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
  [[Category:G03F7/09]] [[Category:G03F7/095]]
  4 KB (495 words) - 15:21, 22 August 2024
• Taiwan semiconductor manufacturing company, ltd. (20240282575). SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE simplified abstract
  [[Category:G03F7/09]] [[Category:G03F7/095]]
  4 KB (511 words) - 07:06, 22 August 2024
• 18047688. METHOD FOR MANUFACTURING MICROSTRUCTURE, METHOD FOR MANUFACTURING LIQUID EJECTION HEAD, MICROSTRUCTURE AND LIQUID EJECTION HEAD simplified abstract (CANON KABUSHIKI KAISHA)
  [[Category:G03F7/095]] [[Category:G03F7/039]]
  4 KB (521 words) - 03:43, 3 January 2024
• SK hynix Inc. patent applications on March 13th, 2025
  ...:Category:CPC_G03F7/2022|G03F7/2022]] (1), [[:Category:CPC_H03L7/095|H03L7/095]] (1), [[:Category:CPC_H10D30/6728|H10D30/6728]] (1), [[:Category:CPC_H10D1 IPC Code(s): G03F7/20, H01L21/027, H01L21/033
  29 KB (4,623 words) - 16:42, 14 March 2025
• Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on August 22nd, 2024
  ...0, G03F7/004, G03F7/038, G03F7/20, G03F7/30, G03F7/32, G03F7/36, G03F7/38, G03F7/40 CPC Code(s): G03F7/0397
  105 KB (15,373 words) - 07:11, 22 August 2024
• Lam Research Corporation Patent Application Trends in 2024
  * [[:Category:CPC_G03F7/707|G03F7/707]] (No explanation available) [[Category:CPC_G03F7/095]]
  16 KB (2,093 words) - 08:19, 16 July 2024
• International Business Machines Corporation patent applications on August 22nd, 2024
  IPC Code(s): B60W50/14, B60K35/00, B60W30/095, B60W50/00, G06N20/00 ...the vehicle.[[Category:B60W50/14]][[Category:B60K35/00]][[Category:B60W30/095]][[Category:B60W50/00]][[Category:G06N20/00]][[Category:CPC_B60W50/14]][[Ca
  58 KB (8,276 words) - 07:37, 22 August 2024
• LAM RESEARCH CORPORATION Patent Application Trends in 2025
  * [[:Category:CPC_G03F7/707|G03F7/707]] (PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. F [[Category:CPC_G03F7/095]]
  22 KB (2,989 words) - 05:13, 17 January 2025
• Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on September 12th, 2024
  IPC Code(s): H01L21/683, G03F7/00, G03F7/20 ...he substrate holder.[[Category:H01L21/683]][[Category:G03F7/00]][[Category:G03F7/20]][[Category:CPC_H01L21/6833]][[Category:taiwan semiconductor manufacturi
  86 KB (12,527 words) - 03:30, 13 September 2024
• Patent Applications Report for 14th Feb 2025
  ...|G06F3/01]] (2), [[:Category:G06T7/70|G06T7/70]] (2), [[:Category:G03F7/00|G03F7/00]] (1), [[:Category:H01Q1/27|H01Q1/27]] (1), [[:Category:G06V40/20|G06V40 [[:Category:CPC_G03F7/001|G03F7/001]] (1), [[:Category:CPC_G06F3/011|G06F3/011]] (1), [[:Category:CPC_G06F3
  90 KB (11,131 words) - 16:48, 19 February 2025
• CANON KABUSHIKI KAISHA patent applications on February 29th, 2024
  IPC Code(s): G03F7/00, B29C59/00, B29C59/02 ...with the curable composition by the film forming operation unit.[[Category:G03F7/00]][[Category:B29C59/00]][[Category:B29C59/02]][[Category:canon kabushiki
  108 KB (16,553 words) - 04:58, 4 March 2024
• Patent Applications Report for 7th Mar 2025
  ..., [[:Category:H01L21/02|H01L21/02]] (4 applications), [[:Category:G03F7/20|G03F7/20]] (3 applications) ...gory:G06V20/56|G06V20/56]] (3 applications), [[:Category:B60W30/095|B60W30/095]] (3 applications), [[:Category:H01M10/0585|H01M10/0585]] (2 applications),
  89 KB (11,260 words) - 17:33, 9 March 2025
• Samsung Electronics Co., Ltd. patent applications on February 6th, 2025
  IPC Code(s): C08F120/28, G03F7/004, G03F7/20 ...aining composition:[[Category:C08F120/28]][[Category:G03F7/004]][[Category:G03F7/20]][[Category:CPC_C08F120/28]][[Category:samsung electronics co., ltd.]]
  260 KB (40,452 words) - 09:24, 19 February 2025
• Samsung Electronics Co., Ltd. patent applications on August 15th, 2024
  IPC Code(s): G03F7/00, H01L21/66 CPC Code(s): G03F7/70591
  247 KB (38,146 words) - 06:03, 15 August 2024
• SAMSUNG ELECTRONICS CO., LTD. patent applications on August 15th, 2024
  IPC Code(s): G03F7/00, H01L21/66 CPC Code(s): G03F7/70591
  247 KB (38,146 words) - 15:49, 18 August 2024
• Blockchain patent applications on January 18th, 2024
  ...): B60W60/00, G08G1/16, B60W50/00, B60W30/18, B60W10/18, B60W10/20, B60W30/095 ...y:B60W30/18]][[Category:B60W10/18]][[Category:B60W10/20]][[Category:B60W30/095]][[Category:Hitachi Astemo, Ltd.]]
  295 KB (42,106 words) - 03:43, 22 January 2024
• Blockchain patent applications on February 1st, 2024
  IPC Code(s): B23K9/09, B23K9/173, B23K9/095 [[Category:B23K9/09]][[Category:B23K9/173]][[Category:B23K9/095]][[Category:Fronius International GmbH]]
  313 KB (44,738 words) - 04:14, 2 February 2024
• Blockchain patent applications on February 22nd, 2024
  IPC Code(s): B60W60/00, B60W10/18, B60W30/09, B60W30/095 ...y:B60W60/00]][[Category:B60W10/18]][[Category:B60W30/09]][[Category:B60W30/095]][[Category:Mitsubishi Electric Research Laboratories, Inc.]]
  281 KB (40,348 words) - 07:08, 22 February 2024
• Blockchain patent applications on April 18th, 2024
  IPC Code(s): B60W60/00, B60W30/095, B60W50/00 [[Category:B60W60/00]][[Category:B60W30/095]][[Category:B60W50/00]][[Category:ZF Friedrichshafen AG]]
  313 KB (44,711 words) - 16:36, 20 April 2024

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