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• Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on September 26th, 2024
  ...1), [[:Category:H01L29/423|H01L29/423]] (20), [[:Category:H01L29/06|H01L29/06]] (18), [[:Category:H01L21/768|H01L21/768]] (15), [[:Category:H01L29/78|H01 IPC Code(s): B24B51/00, B24B7/22, B24D7/18
  135 KB (19,652 words) - 07:12, 27 September 2024
• Samsung Electronics Co., Ltd. patent applications on February 6th, 2025
  ...[:Category:CPC_H04W64/00|H04W64/00]] (2), [[:Category:CPC_H04W60/06|H04W60/06]] (2) IPC Code(s): A46B17/06, A46B13/00, B08B1/52, B08B3/12, H01L21/67
  260 KB (40,452 words) - 09:24, 19 February 2025