Sk hynix inc. (20240339435). SEMICONDUCTOR PACKAGE INCLUDING CONTROL CHIP INCLUDING CHIP ENABLE SIGNAL CONTROL CIRCUIT simplified abstract
Contents
SEMICONDUCTOR PACKAGE INCLUDING CONTROL CHIP INCLUDING CHIP ENABLE SIGNAL CONTROL CIRCUIT
Organization Name
Inventor(s)
Ki Yong Lee of Icheon-si Gyeonggi-do (KR)
SEMICONDUCTOR PACKAGE INCLUDING CONTROL CHIP INCLUDING CHIP ENABLE SIGNAL CONTROL CIRCUIT - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240339435 titled 'SEMICONDUCTOR PACKAGE INCLUDING CONTROL CHIP INCLUDING CHIP ENABLE SIGNAL CONTROL CIRCUIT
The semiconductor package described in the abstract consists of a package substrate, multiple memory chips stacked on the substrate, and a control chip positioned above the memory chips. The control chip includes various control pads for transmitting chip enable signals to and from the memory chips, as well as to and from an external electronic device. Additionally, there is a chip enable signal control circuit within the control chip that manages the transmission paths of the chip enable signals between the control pads.
- The semiconductor package includes a control chip with multiple control pads for transmitting chip enable signals.
- The control chip also has a chip enable signal control circuit to manage the transmission paths of the signals.
- The package substrate supports the memory chips stacked on top of it.
- The control chip is spaced apart from the memory chips to optimize functionality.
- The control chip receives a path control signal from an external electronic device to control the chip enable signal control circuit.
Potential Applications: - This technology can be applied in various electronic devices requiring memory chip control. - It can be used in data storage systems, mobile devices, and other semiconductor applications.
Problems Solved: - Efficient transmission and control of chip enable signals between memory chips and external devices. - Optimization of space and functionality within a semiconductor package.
Benefits: - Improved performance and reliability of memory chip control. - Enhanced functionality and communication between memory chips and external devices.
Commercial Applications: - This technology can be utilized in the development of advanced data storage systems, mobile devices, and other semiconductor products.
Questions about the technology: 1. How does the control chip manage the transmission paths of the chip enable signals? 2. What are the potential advantages of having a control chip spaced apart from the memory chips in a semiconductor package?
Original Abstract Submitted
a semiconductor package includes a package substrate, a plurality of memory chips stacked over the package substrate, and a control chip disposed over the package substrate to be spaced apart from the plurality of memory chips. the control chip includes a plurality of first chip enable signal control pads transmitting chip enable signals to and from the plurality of memory chips, a plurality of second chip enable signal control pads transmitting the chip enable signals to and from an external electronic device external to the semiconductor package, a chip enable signal control circuit configured to control transmission paths of the chip enable signals between the plurality of first chip enable signal control pads and the plurality of second chip enable signal control pads, and a third chip enable signal control pad receiving a path control signal from the external electronic device for controlling the chip enable signal control circuit.
