Sk hynix inc. (20240282756). SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS simplified abstract
Contents
SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS
Organization Name
Inventor(s)
Jin Kyoung Park of Icheon-si Gyeonggi-do (KR)
SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240282756 titled 'SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS
The semiconductor package described in the abstract includes a base layer with two chip stacks stacked on top, each containing multiple semiconductor chips with exposed chip pads on one side edge. These chip pads include stack identification pads and chip identification pads for identifying the stacks and individual chips.
- The package features inter-chip wires connecting power-applied chip identification pads of the semiconductor chips in each stack.
- Additionally, stack wires connect the chip identification pad of the lowermost chip in each stack to the base layer.
Potential Applications: - This technology can be used in various electronic devices such as smartphones, tablets, and computers. - It can also be applied in automotive electronics, medical devices, and industrial equipment.
Problems Solved: - Simplifies the identification and connection of semiconductor chips in a package. - Enhances the efficiency of power distribution within the package.
Benefits: - Improved organization and identification of semiconductor chips. - Enhanced reliability and performance of electronic devices.
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Performance This technology can be utilized by semiconductor manufacturers to produce more efficient and reliable electronic devices, catering to a wide range of industries.
Questions about the technology: 1. How does this semiconductor packaging technology improve power distribution efficiency?
- The inter-chip wires and stack wires ensure a more streamlined power distribution process within the package, enhancing overall efficiency.
2. What are the key advantages of using stack identification pads in semiconductor chip stacks?
- Stack identification pads help in easily identifying and distinguishing between different chip stacks, aiding in efficient organization and maintenance of the package.
Original Abstract Submitted
a semiconductor package including: a base layer; a first chip stack and a second chip stack sequentially stacked over the base layer, each of the first and second chip stacks including a plurality of semiconductor chips which are offset stacked to expose chip pads at one side edge thereof, and the chip pads including stack identification pads for identifying the first chip stack and the second chip stack and chip identification pads for identifying the plurality of semiconductor chips in each of the first and second chip stacks; a first inter-chip wire and a second inter-chip wire connecting power-applied ones of the chip identification pads of the plurality of semiconductor chips of the first and second chip stacks; a first stack wire and second stack wire connecting the chip identification pad of a lowermost semiconductor chip of the first and second chip stacks to the base layer.
