Sk hynix inc. (20240178172). SEMICONDUCTOR DEVICE INCLUDING RESISTOR ELEMENT simplified abstract
Contents
- 1 SEMICONDUCTOR DEVICE INCLUDING RESISTOR ELEMENT
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR DEVICE INCLUDING RESISTOR ELEMENT - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR DEVICE INCLUDING RESISTOR ELEMENT
Organization Name
Inventor(s)
Chan Ho Yoon of Icheon-si (KR)
SEMICONDUCTOR DEVICE INCLUDING RESISTOR ELEMENT - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240178172 titled 'SEMICONDUCTOR DEVICE INCLUDING RESISTOR ELEMENT
Simplified Explanation
The semiconductor device described in the abstract consists of two chips stacked on top of each other, with pads and resistor elements defined on each chip and coupled together.
- The first chip has a first pad and a first resistor element defined on one surface.
- The second chip has a second pad defined on one surface and is stacked on the first chip, bonded to the first pad.
- A second resistor element is defined in the second chip and coupled to the second pad.
Potential Applications
This technology could be applied in various electronic devices such as sensors, actuators, and communication systems.
Problems Solved
This technology allows for more compact and efficient semiconductor devices by stacking chips and integrating resistor elements within them.
Benefits
- Increased integration and miniaturization of semiconductor devices - Improved performance and reliability due to the close coupling of resistor elements
Potential Commercial Applications
Optimizing Power Consumption in IoT Devices
Possible Prior Art
There may be prior art related to the stacking of chips in semiconductor devices and the integration of resistor elements within them.
Unanswered Questions
How does this technology impact the overall cost of semiconductor devices?
The abstract does not provide information on the cost implications of implementing this technology. Further research or analysis would be needed to determine the cost-effectiveness of this approach.
What are the potential challenges in manufacturing semiconductor devices using this technology?
The abstract does not address any potential manufacturing challenges that may arise when implementing this technology. Additional investigation would be required to identify and overcome any such challenges.
Original Abstract Submitted
a semiconductor device includes a first pad defined on one surface of a first chip; a second pad defined on one surface of a second chip which is stacked on the first chip, and bonded to the first pad; a first resistor element defined in the first chip, and coupled to the first pad; and a second resistor element defined in the second chip, and coupled to the second pad.
