Sk hynix inc. (20240162176). SEMICONDUCTOR PACKAGE INCLUDING BUMP INTERCONNECTION STRUCTURE simplified abstract
Contents
SEMICONDUCTOR PACKAGE INCLUDING BUMP INTERCONNECTION STRUCTURE
Organization Name
Inventor(s)
Kang Hun Kim of Icheon-si Gyeonggi-do (KR)
Si Yun Kim of Icheon-si Gyeonggi-do (KR)
Jun Yong Song of Icheon-si Gyeonggi-do (KR)
SEMICONDUCTOR PACKAGE INCLUDING BUMP INTERCONNECTION STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240162176 titled 'SEMICONDUCTOR PACKAGE INCLUDING BUMP INTERCONNECTION STRUCTURE
Simplified Explanation
The semiconductor package described in the patent application includes a bump interconnection structure, a first lead, a second lead, a bump, and a solder layer. The first lead and second lead are on separate substrates, with the bump connecting the first lead to the second substrate. The first lead has a stair shape that ascends towards the second lead.
- Explanation of the patent/innovation:
- The semiconductor package features a unique bump interconnection structure that allows for efficient connection between leads on different substrates. - The stair-shaped first lead provides a specific design for improved connectivity and performance within the package.
- Potential applications of this technology:
- This technology could be used in various electronic devices such as smartphones, tablets, and computers. - It could also be applied in automotive electronics, medical devices, and industrial equipment.
- Problems solved by this technology:
- The bump interconnection structure helps address the challenge of connecting leads on separate substrates in a semiconductor package. - The stair-shaped first lead design improves the reliability and efficiency of the interconnection within the package.
- Benefits of this technology:
- Enhanced connectivity and performance in semiconductor packages. - Improved reliability and durability of electronic devices using this technology.
- Potential commercial applications of this technology:
- Manufacturers of electronic devices could benefit from incorporating this innovative semiconductor package design. - Companies in the semiconductor industry could license this technology for their products.
- Possible prior art:
- Prior art may include traditional bump interconnection structures in semiconductor packages. - Other designs for lead connections in semiconductor packages could also be considered as prior art.
Questions:
1. How does the stair-shaped first lead design improve the connectivity within the semiconductor package? 2. What specific electronic devices could benefit the most from this bump interconnection structure technology?
Original Abstract Submitted
a semiconductor package includes a bump interconnection structure. the semiconductor package includes a first lead and a second lead spaced apart from each other on a first substrate, a bump disposed to face the first lead in a second substrate, and a solder layer configured to connect the bump and the first lead. the first lead has a stair shape that ascends toward the second lead.
